Review of Power Electronics Components at Cryogenic Temperatures

In order to apply power electronics systems to applications such as superconducting systems under cryogenic temperatures, it is necessary to investigate the characteristics of different parts in the power electronics system. This article reviews the influence of cryogenic temperature on power semico...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on power electronics 2020-05, Vol.35 (5), p.5144-5156
Main Authors: Gui, Handong, Chen, Ruirui, Niu, Jiahao, Zhang, Zheyu, Tolbert, Leon M., Wang, Fei Fred, Blalock, Benjamin J., Costinett, Daniel, Choi, Benjamin B.
Format: Article
Language:English
Subjects:
Basic converters
Circuit boards
CMOS
Cryogenic converter
Cryogenic effects
Cryogenic engineering
Cryogenic temperature
Cryogenics
Dielectrics
Electronics
Insulation
integrated circuit
Integrated circuits
interconnection and dielectric material
Magnetic cores
Metal oxides
MOSFET
Passive components
Power electronics
power semiconductor device
Power semiconductor devices
Resistors
Schottky diodes
Silicon
Silicon carbide
Switches
Temperature
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In order to apply power electronics systems to applications such as superconducting systems under cryogenic temperatures, it is necessary to investigate the characteristics of different parts in the power electronics system. This article reviews the influence of cryogenic temperature on power semiconductor devices including Si and wide bandgap switches, integrated circuits, passive components, interconnection and dielectric materials, and some typical cryogenic converter systems. Also, the basic theories and principles are given to explain the trends for different aspects of cryogenically cooled converters. Based on the review, Si active power devices, bulk Complementary metal-oxide-semiconductor (CMOS) based integrated circuits, nanocrystalline and amorphous magnetic cores, NP0 ceramic and film capacitors, thin/metal film and wirewound resistors are the components suitable for cryogenic operation. Pb-rich PbSn solder or In solder, classic printed circuit boards material, most insulation papers and epoxy encapsulant are good interconnection and dielectric parts for cryogenic temperatures.
ISSN:0885-8993
1941-0107
DOI:10.1109/TPEL.2019.2944781