Effect of Görtler-like vortices of various intensity on heat transfer in supersonic compression corner flows

• Published in: International journal of heat and mass transfer 2020-04, Vol.150, p.119310, Article 119310
• Main Authors: Chuvakhov, P.V., Radchenko, V.N.
• Format: Article
• Language: English
• Subjects: Compression corner; Compression ramp; Controlled vortex intensity; Corner flow; Flat plates; Fluid dynamics; Fluid flow; Görtler vortices; Heat flux; Heat transfer; Laminar flow; Reattachment vortices; Stability; Supersonic; Vortices; Wind tunnels
• ISSN: 0017-9310; 1879-2189
• DOI: 10.1016/j.ijheatmasstransfer.2020.119310

•Schlieren/TSP experimental results on Gortler-like reattachment vortices in supresonic compression corner flows are reported, for which the vortices are excited naturally or seeded artificially.•The vortices are capable of increasing not only the spanwise variation of heat flux but also the spanwise-averaged heat flux level.•The effect of vortices on heat flux saturates as the height of controlled seeding elements (a comb of cylinders) increases.•Spanwise variations of heat transfer coefficient increases nearly linearly with the height of the seeding elements for moderate height values, with no variations at no roughness. Experiments on heat transfer over Mach 8, 15° compression corner flow affected by Görtler-like reattachment vortices of controllable intensity are carried out in the shock wind tunnel UT-1 M (TsAGI). Experiments cover two Reynolds numbers Re∞,L=(1.75±0.08) × 105 and Re∞,L=(3.90±0.15) × 105 based on the sharp flat plate length at which the reattachment flow is close to laminar or beginning transitional, respectively. The effect of streamwise vortices of different intensity on spanwise variations of the heat flux and its spanwise-averaged level at the reattachment region is investigated. The intensity of the vortices is varied by accurate controlling the height of a spanwise rake of cylindrical pins (seeding elements) placed on the plate ahead of the separation bubble.