Uniformly Dispersed Nano-SiO2 Particles Reinforced Copper Matrix by Chemical Coprecipitation Method

Nano-Cu-based materials have many applications in the microelectronics and aerospace industries, which not only maintain the advantages of copper materials, but also make up for the shortage of copper. In this paper, the precursor powder of silica-reinforced copper matrix composites was prepared by...

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Bibliographic Details
Published in:Integrated ferroelectrics 2020-01, Vol.210 (1), p.148-155
Main Authors: Bai, Yunlong, Li, Yulong, Wang, Jian, Fan, Wenji, Li, Zaiyuan, Fu, Yan, Lu, Yuhe, Wang, Wei
Format: Article
Language:English
Subjects:
Aerospace industry
Cold pressing
Copper
Coprecipitation
High temperature
Metal matrix composites
Precursors
Silicon dioxide
Sintering (powder metallurgy)
Solid phases
Temperature
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Summary:Nano-Cu-based materials have many applications in the microelectronics and aerospace industries, which not only maintain the advantages of copper materials, but also make up for the shortage of copper. In this paper, the precursor powder of silica-reinforced copper matrix composites was prepared by chemical coprecipitation method, which main ingredients are Cu4SO4(OH)6 and SiO2. The precursor powder was reduced by hydrogen in 450 °C for 4 h to obtain SiO2-Cu composite powder, and then treated by cold press pressing and solid phase high temperature sintering to obtain nano-silica copper matrix composite. The results show that that the reinforcing phase and matrix are mutually dispersed in the process of coprecipitation, and the composite gains more homogeneous size and higher hardness as the dispersion effect of reinforcement on the copper matrix achieves the best.
ISSN:1058-4587
1607-8489