Recent development and application of thin-film thermoelectric cooler

Recently, the performance and fabrication of thin-film thermoelectric materials have been largely enhanced. Based on this enhancement, the thin-film thermoelectric cooler (TEC) is becoming a research hot topic, due to its high cooling flux and microchip level size. To fulfill a thin-film TEC, interf...

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Bibliographic Details
Published in:Frontiers of chemical science and engineering 2020-08, Vol.14 (4), p.492-503
Main Authors: Yu, Yuedong, Zhu, Wei, Kong, Xixia, Wang, Yaling, Zhu, Pengcheng, Deng, Yuan
Format: Article
Language:English
Subjects:
Antimony
Bismuth
Chemical vapor deposition
Chemistry
Chemistry and Materials Science
Contact resistance
Industrial Chemistry/Chemical Engineering
Nanotechnology
Physical vapor deposition
Review Article
Solid solutions
Tellurium
Thermal contact resistance
Thermal resistance
Thermoelectric cooling
Thermoelectric materials
Thin films
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Summary:Recently, the performance and fabrication of thin-film thermoelectric materials have been largely enhanced. Based on this enhancement, the thin-film thermoelectric cooler (TEC) is becoming a research hot topic, due to its high cooling flux and microchip level size. To fulfill a thin-film TEC, interfacial problems are unavoidable, as they may largely reduce the properties of a thin-film TEC. Moreover, the architecture of a thin-film TEC should also be properly designed. In this review, we introduced the enhancement of thermoelectric properties of (Bi,Sb) 2 (Te,Se) 3 solid solution materials by chemical vapor deposition, physical vapor deposition and electrodeposition. Then, the interfacial problems, including contact resistance, interfacial diffusion and thermal contact resistance, were discussed. Furthermore, the design, fabrication, as well as the performance of thin-film TECs were summarized.
ISSN:2095-0179
2095-0187
DOI:10.1007/s11705-019-1829-9