Thermal Diffusivity of Ag/CNT-Added Ag Nanocomposites Prepared by Spark Plasma Sintering

As electronic devices have become smaller, the importance of heat dissipation has grown. Therefore, to contribute to heat emission reduction efforts, we investigated the thermal diffusivity of Ag/CNT added to Ag matrix and compared it to that of pure Ag. The composite consisted of 99 wt% Ag and 1 wt...

Full description

Saved in:
Bibliographic Details
Published in:International journal of precision engineering and manufacturing 2020-07, Vol.21 (7), p.1357-1362
Main Authors: Kim, Sangwoo, Park, Suyoung, Kim, DongEung, Jin, Changhyun
Format: Article
Language:English
Subjects:
Diffusivity
Electronic devices
Emission analysis
Emissions control
Engineering
Industrial and Production Engineering
Materials Science
Nanocomposites
Plasma sintering
Regular Paper
Silver
Spark plasma sintering
Thermal diffusivity
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:As electronic devices have become smaller, the importance of heat dissipation has grown. Therefore, to contribute to heat emission reduction efforts, we investigated the thermal diffusivity of Ag/CNT added to Ag matrix and compared it to that of pure Ag. The composite consisted of 99 wt% Ag and 1 wt% Ag/CNT. All samples, including the pure Ag sample, were densified via 10-min spark plasma sintering at 600 °C and 100 MPa. The morphological analysis of the samples was performed using SEM and TEM and their microstructure was derived through XRD. Two different thermal diffusivities were determined via the laser flash method. The remarkable increase in thermal diffusivity, even with the addition of as little as 1% of Ag/CNT, clearly shows that this is a feasible solution to the problem of heat dissipation in electronic devices.
ISSN:2234-7593
2005-4602
DOI:10.1007/s12541-020-00334-8