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Impact of interface trap charges on device level performances of a lateral/vertical gate stacked Ge/Si TFET-on-SELBOX-substrate

This paper reports the TCAD based investigation of the DC/RF and linearity characteristics of a newly proposed dual-material (DM) laterally-stacked (LS) SiO 2 /HfO 2 heterojunction-TFET-on-SELBOX substrate (LS-STFET). Device-level performance comparison is made between the proposed TFET with a dual-...

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Published in:Applied physics. A, Materials science & processing Materials science & processing, 2020-09, Vol.126 (9), Article 681
Main Authors: Singh, Ashish Kumar, Tripathy, Manas Ranjan, Baral, Kamalaksha, Singh, Prince Kumar, Jit, Satyabrata
Format: Article
Language:English
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Summary:This paper reports the TCAD based investigation of the DC/RF and linearity characteristics of a newly proposed dual-material (DM) laterally-stacked (LS) SiO 2 /HfO 2 heterojunction-TFET-on-SELBOX substrate (LS-STFET). Device-level performance comparison is made between the proposed TFET with a dual-material (DM) vertically-stacked (VS) SiO 2 /HfO 2 heterojunction-TFET-on-SELBOX substrate (VS-STFET). Low bandgap material Ge is used in the source region to form a Ge (source)/Si (channel) heterojunction for enhancing the ON-state current of the presented TFETs. The effects of both donor (+ ve) and acceptor (−ve) type interface trap charges at the channel/SiO 2 region on the DC, analogue/RF and linearity figure of merits have been analyzed for both the devices under study. The LS-STFET is shown to possess higher ON-state current and smaller subthreshold swing (SS) over the VS-STFET. In addition, the LS-STFET is shown to have better DC, analog/RF and linearity performance over VS-STFET in the presence of the donor and acceptor interface trap charges.
ISSN:0947-8396
1432-0630
DOI:10.1007/s00339-020-03869-9