Simultaneously enhance thermal conductive property and mechanical properties of silicon rubber composites by introducing ultrafine Al2O3 nanospheres prepared via thermal plasma

It is great significant to develop polymer composites with high thermal conductivity and excellent mechanical properties simultaneously. Generally, a high loading of fillers is required for thermal conductive composites. However, traditional polymer composites exhibit unsatisfactory enhancement due...

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Bibliographic Details
Published in:Composites science and technology 2020-04, Vol.190, p.108019, Article 108019
Main Authors: Ouyang, Yuge, Li, Xiaofei, Ding, Fei, Bai, Liuyang, Yuan, Fangli
Format: Article
Language:English
Subjects:
Adhesive strength
Al2O3 nanospheres
Aluminum oxide
Composite materials
Dielectric properties
Fillers
Fracture toughness
Heat conductivity
Heat transfer
Mechanical properties
Nanospheres
Polymer matrix composites
Polymer-matrix composites (PMCs)
Polymers
Rubber
Silicon
Tensile strength
Thermal conductivity
Thermal plasmas
Thermal stability
Ultrafines
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Summary:It is great significant to develop polymer composites with high thermal conductivity and excellent mechanical properties simultaneously. Generally, a high loading of fillers is required for thermal conductive composites. However, traditional polymer composites exhibit unsatisfactory enhancement due to poor dispersion and weak interfacial adhesion, for which lead to high interfacial resistance. Meanwhile, the mechanical properties of composites are greatly damaged because of internal defects caused by imperfect filling. Herein, Al2O3 nanospheres prepared by high frequency thermal plasma are first used as filler to increase thermal conductivity of silicon rubber (SR) and reinforce the mechanical properties of SR. The Al2O3 nanospheres show good compatibility and strong interfacial adhesion with matrix. Thus SR composites exhibit excellent thermal conductivity of 1.53 Wm−1K−1, corresponding to an enhancement of 665% compared to SR. Importantly, the SR composites still possess high tensile strength of 5.71 MPa, modulus of 9.69 MPa and fracture toughness of 1.81 MJ/m3 respectively, improving by 1630%, 3360% and 723% compared with neat SR. In addition, The Al2O3/SR composites also possess good dielectric properties, high volume resistivity and enhanced thermal stability, indicating a promising application of composites in the field of electronic packing. Therefore, this work offers a novel route to design high performance SR composites using Al2O3 nanospheres prepared by thermal plasma.
ISSN:0266-3538
1879-1050
DOI:10.1016/j.compscitech.2020.108019