Scaling of Multi-contact Phase Change Device for Toggle Logic Operations

Scaling of two dimensional six-contact phase change devices that can perform toggle logic operations is analyzed through 2D electrothermal simulations with dynamic materials modeling, integrated with CMOS access circuitry. Toggle configurations are achieved through a combination of isolation of some...

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Bibliographic Details
Published in:arXiv.org 2020-08
Main Authors: Raihan Sayeed Khan, Kanan, Nadim H, Scoggin, Jake, Silva, Helena, Gokirmak, Ali
Format: Article
Language:English
Subjects:
Circuits
CMOS
Computer simulation
Coupling
Crosstalk
Logic
Phase change
Scaling
Transistors
Two dimensional analysis
Two dimensional models
Volatility
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Summary:Scaling of two dimensional six-contact phase change devices that can perform toggle logic operations is analyzed through 2D electrothermal simulations with dynamic materials modeling, integrated with CMOS access circuitry. Toggle configurations are achieved through a combination of isolation of some contacts from others using amorphous regions and coupling between different regions via thermal crosstalk. Use of thermal crosstalk as a coupling mechanism in a multi-contact device in the memory layer allows implementation of analog routing and digital logic operations at a significantly lower transistor count, with the added benefit of non-volatility. Simulation results show approximately linear improvement in peak current and voltage requirements with thickness scaling.
ISSN:2331-8422