Loading…

Signal transfer via smart conductive networks for high temperature performing wearable electronics

High temperature performing textile conductive networks for wearable electronic applications are demonstrated. Different types of conductive yarns, namely steel, copper, and silver-coated were used as signal transmission tracks in order to configure the smart conductive network architecture. Conduct...

Full description

Saved in:
Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2020-09, Vol.31 (18), p.15996-16007
Main Authors: Karabulut, Ercan, Kurşun Bahadır, Senem
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:High temperature performing textile conductive networks for wearable electronic applications are demonstrated. Different types of conductive yarns, namely steel, copper, and silver-coated were used as signal transmission tracks in order to configure the smart conductive network architecture. Conductive networks were formed between the layers of high temperature-resistant fabric substrates which of the following substrates most likely consist of reactively sputtered aluminum particles, polybenzimidazoles (PBI), aramid, and glass fibers. The specimens were constructed using welding and conventional sewing techniques and their operating characteristics in terms of high temperature resistance (limited flame spread, convective heat transfer, radiant heat) and electrical properties (conductivity and signal quality in data transfer) were determined. As a result of thermal tests, the excellent performances among conductive networks are attributed to steel and copper threads used as signal transmission line hidden in the interface among aluminum, 100 % aramid (nonwoven), and epoxy layer used as a substrate. The efficient exploitation of smart conductive networks will boost the viability of data transfer quality among wearable electronic components performing at high temperatures.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-020-04161-5