Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle

An experimental investigation and numerical modeling using multiphysics finite element method were performed to study the thermal failure mechanism of low-profile quad flat package solder joints of memory module due to low-cycle fatigue. The strain, stress, and number of cycles to failure have been...

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Bibliographic Details
Published in:Proceedings of the Institution of Mechanical Engineers. Part C, Journal of mechanical engineering science Journal of mechanical engineering science, 2020-11, Vol.234 (21), p.4277-4287
Main Authors: Halouani, Ayda, Cherouat, Abel, Miladi Chaabane, Mariem, Haddar, Mohamed
Format: Article
Language:English
Subjects:
Crack initiation
Crack propagation
Creep fatigue
Damage assessment
Experimentation
Failure mechanisms
Fatigue cracks
Fatigue failure
Fatigue life
Finite element method
Fracture mechanics
Low cycle fatigue
Soldered joints
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Summary:An experimental investigation and numerical modeling using multiphysics finite element method were performed to study the thermal failure mechanism of low-profile quad flat package solder joints of memory module due to low-cycle fatigue. The strain, stress, and number of cycles to failure have been calculated according to a strain life Coffin–Manson and energy-based Morrow fatigue models. Scanning electron microscopy imaging at the end of thermal cycle was used to evaluate the damage initiation and propagation. The effect of the solder volume on fatigue life of solder joints was discussed. Through analyses of theoretical results and experimental data on fatigue life, cracks initiation and propagation have been highlighted and their possible causes have been discussed.
ISSN:0954-4062
2041-2983
DOI:10.1177/0954406220920680