Electrodeposition of FeCoP nanoglass films

In this study, FeCoP nanoglass films were prepared via electrodeposition on the copper substrate. The microstructures, chemical compositions and mechanical properties of deposited films were characterized via XRD, SEM, and nanoindentation, respectively. The results revealed that all films present fu...

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Bibliographic Details
Published in:Microelectronic engineering 2020-05, Vol.229, p.111363, Article 111363
Main Authors: Zhou, Peng, Li, Qiaomin, Gong, Pan, Wang, Xinyun, Zhang, Mao
Format: Article
Language:English
Subjects:
Amorphous structure
Chemical composition
Electric potential
Electrodeposition
Grain boundaries
Grain size
Hardness
Indentation
Mechanical properties
Microstructure
Modulus of elasticity
Nanoglass
Nanoindentation
Nanoparticles
Nanostructured materials
Structural hierarchy
Substrates
Surface roughness
Thin films
Voltage
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Summary:In this study, FeCoP nanoglass films were prepared via electrodeposition on the copper substrate. The microstructures, chemical compositions and mechanical properties of deposited films were characterized via XRD, SEM, and nanoindentation, respectively. The results revealed that all films present fully amorphous structures, without any crystalline phases detected. The films have a hierarchical structure, with nano-sized amorphous particles densely packing in micro-sized grains separated by distinct grain boundaries. With the increase of deposition voltage, the grain size increases, the surface roughness reduces, and the concentration of iron rises. These films present favorable mechanical properties, reaching a maximum hardness of 6.89 GPa and elastic modulus of 138.85 GPa at the deposition voltage of 1.1 V. [Display omitted] •FeCoP nanoglass films are prepared via electrodeposition.•The deposited nanoglass has a hierarchical structure.•FeCoP nanoglass has superior hardness and elastic modulus.•Increasing deposition voltage increases grain size of nanoglass.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2020.111363