Microstructural characterization of cold-drawn Cu–Ni–Si alloy having high strength and high conductivity

• Published in: Journal of alloys and compounds 2020-08, Vol.832, p.155059, Article 155059
• Main Authors: Kim, Hwangsun, Ahn, Jee Hyuk, Han, Seung Zeon, Jo, Janghyun, Baik, Hionsuck, Kim, Miyoung, Han, Heung Nam
• Format: Article
• Language: English
• Subjects: Alloys; Cellular precipitates; Cold drawing; Copper; Copper base alloys; Cu alloy; Electrical resistivity; Electron microscopes; Electron microscopy; High strength alloys; Intermetallics; Microscopy; Microstructure; Nanostructured materials; Nickel; Precipitates; Silicon; Transmission electron microscopy
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2020.155059

A Cu alloy with high strength and conductivity, which are trade off characteristics, was developed using discontinuous precipitates as the hardening agent. The scanning electron microscopy and transmission electron microscopy results showed that a considerable internal strain and geometrically necessary dislocations were generated in the alloy because of discontinuous precipitation. Furthermore, nanotwins, which are rarely observed in cold-drawn Cu–Ni–Si alloys, were observed in the alloy. Since nanotwins show little effect on the electrical resistivity of Cu alloys while effectively interfering with the dislocation movement, they are one of the key factors endowing Cu alloys with the trade-off characteristics of high strength and conductivity. •Microstructure of Cu–Ni–Si alloy having high strength and conductivity was observed.•Discontinuous precipitation induces strain development in Cu–Ni–Si alloy.•Nanotwins was formed by cold-drawing.