Wettability, microstructure, and tensile properties of Sn– 3.0Ag–0.5Cu solder alloy prepared by reflow oven and susceptor-assisted microwave

A susceptor-assisted microwave (SAM) has been recognized as one of soldering methods for lead-free solder alloys. In this study, the effect of the soldering method on the wettability, microstructure, and tensile properties of the Sn3.0Ag0.5Cu (SAC305) solder alloy were investigated. The SAC305/Cu wa...

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Bibliographic Details
Main Authors: Said, Mardiana, Mohamad, Ahmad Azmin
Format: Conference Proceeding
Language:English
Subjects:
Alloys
Cross-sections
Grain size
Intermetallic compounds
Lead free
Microstructure
Morphology
Soldering
Tensile properties
Thickness
Tin base alloys
Ultimate tensile strength
Wettability
Wetting
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Summary:A susceptor-assisted microwave (SAM) has been recognized as one of soldering methods for lead-free solder alloys. In this study, the effect of the soldering method on the wettability, microstructure, and tensile properties of the Sn3.0Ag0.5Cu (SAC305) solder alloy were investigated. The SAC305/Cu was reflowed using a conventional reflow oven (SAC305-O) and a SAM (SAC305-H40) heating. The wettability was measured by the wetting angle and the spreading ratio. The morphology and composition of the intermetallic compound (IMC) joint were evaluated on top-surface and cross-sectional views. The ultimate tensile strength (UTS) was characterized at a maximum load of 5 kN and a crosshead speed of 1 mm min−1. The results indicated that wetting angle and spreading ratio for SAC305-O (30.94°, 86.63%) and SAC305-H40 (18.60°, 92.20%) had a sufficient requirement on the wettability. The top-surface (round shape) and cross-sectional (scallop-shaped) morphologies of SAC305–H40 exhibited smaller grain sizes and thinner (2.47 µm) IMC layers at the solder joint compared to those of SAC305–O (3.65 µm). Compositional analysis confirmed that the observed IMCs consist of Cu6Sn5, Ag3Sn, and Cu3Sn for both samples. The UTS of SAC305-H40 (43.75 MPa) was greater than that of SAC305-O (31.30 MPa). The SAC305-H40 had a 28% reduction in the IMC layer thickness and a 29% increase in the UTS compared to that of SAC305-O. From the findings, the SAM method had a remarkable performance and had a potential as a replacement for the conventional method.
ISSN:0094-243X
1551-7616
DOI:10.1063/5.0015789