9‐2: Manufacturing Process for Mass Production of Micro‐LED Displays and High‐Speed and High‐Yield Laser Lift‐Off Systems

In our previous work, we proposed and evaluated processes and equipment to facilitate the mass production of micro LED (light emitting diode) displays. The new technologies include LLO (laser lift off), mass‐transfer, color conversion and backplane with micro Si chip. We quantitatively evaluated the...

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Published in:SID International Symposium Digest of technical papers 2020-08, Vol.51 (1), p.100-103
Main Authors: Kajiyama, Koichi, Suzuki, Yoshikazu, Hirano, Takafumi, Yanagawa, Yoshikatu, Fukaya, Koichiro, Okura, Naoya, Okuno, Takeshi, Shimoura, Atushi
Format: Article
Language:English
Subjects:
Backplanes
Display
Displays
Electric bonding
Fluorescence
Light emitting diodes
LLO
Mass production
Mass transfer
Micro Si chip
Micro-LED
New technology
PWM
Reconstitution
UV LED
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cited_by cdi_FETCH-LOGICAL-c1464-bcfb85e844de71998ce3a6031d828a27dcbe212b5c63d228e19d2156dfbed51c3
cites cdi_FETCH-LOGICAL-c1464-bcfb85e844de71998ce3a6031d828a27dcbe212b5c63d228e19d2156dfbed51c3
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container_title SID International Symposium Digest of technical papers
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creator Kajiyama, Koichi
Suzuki, Yoshikazu
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description In our previous work, we proposed and evaluated processes and equipment to facilitate the mass production of micro LED (light emitting diode) displays. The new technologies include LLO (laser lift off), mass‐transfer, color conversion and backplane with micro Si chip. We quantitatively evaluated them and report results.
doi_str_mv 10.1002/sdtp.13814
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2168-0159
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subjects Backplanes
Display
Displays
Electric bonding
Fluorescence
Light emitting diodes
LLO
Mass production
Mass transfer
Micro Si chip
Micro-LED
New technology
PWM
Reconstitution
UV LED
title 9‐2: Manufacturing Process for Mass Production of Micro‐LED Displays and High‐Speed and High‐Yield Laser Lift‐Off Systems
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