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Structure of polyamide 6/poly(ethylene terephthalate) blends under high cooling rate and shear stress and their moisture-sensitive properties

Polyamide 6 (PA6) with low moisture-sensitivity is realized by blending with poly(ethylene terephthalate) (PET), the crystal structure and morphology formed under high cooling rate and shear stress are also investigated. A pronounced reduction in the maximum water content from 9.7 to 5.6 wt% accompa...

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Published in:Polymer (Guilford) 2020-08, Vol.203, p.122817, Article 122817
Main Authors: Ma, Guo-Qi, Yang, Hao, Li, Lei, Sun, Zhao-Bo, Miao, Xia-Ran, Bian, Feng-Gang, Xu, Jia-Zhuang, Zhong, Gan-Ji, Gao, Xue-Qin, Li, Zhong-Ming
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cited_by cdi_FETCH-LOGICAL-c337t-61f01893a3ab59e9445420fdf70d417cb99508f371a95737d4a3069b0abf58a13
cites cdi_FETCH-LOGICAL-c337t-61f01893a3ab59e9445420fdf70d417cb99508f371a95737d4a3069b0abf58a13
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container_title Polymer (Guilford)
container_volume 203
creator Ma, Guo-Qi
Yang, Hao
Li, Lei
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Bian, Feng-Gang
Xu, Jia-Zhuang
Zhong, Gan-Ji
Gao, Xue-Qin
Li, Zhong-Ming
description Polyamide 6 (PA6) with low moisture-sensitivity is realized by blending with poly(ethylene terephthalate) (PET), the crystal structure and morphology formed under high cooling rate and shear stress are also investigated. A pronounced reduction in the maximum water content from 9.7 to 5.6 wt% accompanying the variation of the diffusion coefficient from 1.2 × 10−6 to 5.2 × 10−7 mm2/s with the increasing of PET content is achieved. The dielectric constant decreases from 12.3 to 6.2 (@103 Hz) and the dielectric loss decreases from 0.25 to 0.13 (@103 Hz) with the increasing of PET content. The structural characterization confirms that the hydrogen-bonding interactions between PA6 and PET play a major role in the reduction of moisture-sensitivity of PA6 as well as that the evolution of the polymorphism of PA6 that the high shear stress facilitates the formation of α-form while the high cooling rate promotes the generation of γ-form. [Display omitted] •The moisture-sensitivity of polyamide 6 is significantly reduced.•Hydrogen-bonding interactions play a crucial role in the low moisture-sensitivity.•The properties of the blends are well preserved under exposure of water.•The structure of the blends under high cooling rate and shear stress is revealed.
doi_str_mv 10.1016/j.polymer.2020.122817
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[Display omitted] •The moisture-sensitivity of polyamide 6 is significantly reduced.•Hydrogen-bonding interactions play a crucial role in the low moisture-sensitivity.•The properties of the blends are well preserved under exposure of water.•The structure of the blends under high cooling rate and shear stress is revealed.</description><identifier>ISSN: 0032-3861</identifier><identifier>EISSN: 1873-2291</identifier><identifier>DOI: 10.1016/j.polymer.2020.122817</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>Coefficient of variation ; Cooling ; Cooling rate ; Crystal structure ; Dielectric constant ; Dielectric loss ; Diffusion coefficient ; Ethylene ; Hydrogen bonding ; Moisture content ; Moisture-sensitive properties ; Morphology ; Polyamide 6 ; Polyamide resins ; Polyamides ; Polyethylene terephthalate ; Polymer blends ; Polymorphism ; Reduction ; Sensitivity ; Shear stress ; Structural analysis ; Structure ; Water content</subject><ispartof>Polymer (Guilford), 2020-08, Vol.203, p.122817, Article 122817</ispartof><rights>2020 Elsevier Ltd</rights><rights>Copyright Elsevier BV Aug 26, 2020</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c337t-61f01893a3ab59e9445420fdf70d417cb99508f371a95737d4a3069b0abf58a13</citedby><cites>FETCH-LOGICAL-c337t-61f01893a3ab59e9445420fdf70d417cb99508f371a95737d4a3069b0abf58a13</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Ma, Guo-Qi</creatorcontrib><creatorcontrib>Yang, Hao</creatorcontrib><creatorcontrib>Li, Lei</creatorcontrib><creatorcontrib>Sun, Zhao-Bo</creatorcontrib><creatorcontrib>Miao, Xia-Ran</creatorcontrib><creatorcontrib>Bian, Feng-Gang</creatorcontrib><creatorcontrib>Xu, Jia-Zhuang</creatorcontrib><creatorcontrib>Zhong, Gan-Ji</creatorcontrib><creatorcontrib>Gao, Xue-Qin</creatorcontrib><creatorcontrib>Li, Zhong-Ming</creatorcontrib><title>Structure of polyamide 6/poly(ethylene terephthalate) blends under high cooling rate and shear stress and their moisture-sensitive properties</title><title>Polymer (Guilford)</title><description>Polyamide 6 (PA6) with low moisture-sensitivity is realized by blending with poly(ethylene terephthalate) (PET), the crystal structure and morphology formed under high cooling rate and shear stress are also investigated. 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A pronounced reduction in the maximum water content from 9.7 to 5.6 wt% accompanying the variation of the diffusion coefficient from 1.2 × 10−6 to 5.2 × 10−7 mm2/s with the increasing of PET content is achieved. The dielectric constant decreases from 12.3 to 6.2 (@103 Hz) and the dielectric loss decreases from 0.25 to 0.13 (@103 Hz) with the increasing of PET content. The structural characterization confirms that the hydrogen-bonding interactions between PA6 and PET play a major role in the reduction of moisture-sensitivity of PA6 as well as that the evolution of the polymorphism of PA6 that the high shear stress facilitates the formation of α-form while the high cooling rate promotes the generation of γ-form. [Display omitted] •The moisture-sensitivity of polyamide 6 is significantly reduced.•Hydrogen-bonding interactions play a crucial role in the low moisture-sensitivity.•The properties of the blends are well preserved under exposure of water.•The structure of the blends under high cooling rate and shear stress is revealed.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.polymer.2020.122817</doi></addata></record>
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1873-2291
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source ScienceDirect Journals
subjects Coefficient of variation
Cooling
Cooling rate
Crystal structure
Dielectric constant
Dielectric loss
Diffusion coefficient
Ethylene
Hydrogen bonding
Moisture content
Moisture-sensitive properties
Morphology
Polyamide 6
Polyamide resins
Polyamides
Polyethylene terephthalate
Polymer blends
Polymorphism
Reduction
Sensitivity
Shear stress
Structural analysis
Structure
Water content
title Structure of polyamide 6/poly(ethylene terephthalate) blends under high cooling rate and shear stress and their moisture-sensitive properties
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