Microstructure and thermal conductivity of Si-Al-C-O fiber bonded ceramics joined to refractory metals

•Fiber-bonded SiC ceramics were joined to Mo using Cusil-ABA brazing.•Sound, defect-free joints could be performed irrespective of fiber orientation.•Thermal conductivity of the joint was measured, and no interfacial resistance was observed. We explore joining Si-Al-C-O fiber-bonded ceramics to Cu-c...

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Bibliographic Details
Published in:Materials letters 2020-10, Vol.276, p.128203, Article 128203
Main Authors: Vera, M.C., Martinez-Fernandez, J., Singh, M., Casalegno, V., Balagna, C., Ramirez-Rico, J.
Format: Article
Language:English
Subjects:
Aluminum
Brazing alloys
Ceramic bonding
Ceramic fibers
Ceramics
Copper
Fiber orientation
Heat conductivity
Heat transfer
Joining
Materials science
Molybdenum
Refractory metals
Silicon
Silicon carbide
Silver
Thermal conductivity
Thermal resistance
Titanium
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Summary:•Fiber-bonded SiC ceramics were joined to Mo using Cusil-ABA brazing.•Sound, defect-free joints could be performed irrespective of fiber orientation.•Thermal conductivity of the joint was measured, and no interfacial resistance was observed. We explore joining Si-Al-C-O fiber-bonded ceramics to Cu-clad-Mo using an Ag-Ti-Cu brazing alloy. A temperature of 900 °C and times in the range of 10–20 min are required to obtain sound joints irrespectively of the fiber orientation. The reaction layer is 1–2 μm thick and free of pores and defects. The thermal conductivity of the joined samples is well described considering that the metal and the ceramic are in series for thermal resistance. This implies that the joint is highly conductive and forms an almost perfect thermal interface between the two materials, confirming the quality of the obtained brazing layer.
ISSN:0167-577X
1873-4979
DOI:10.1016/j.matlet.2020.128203