Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging

Copper pastes suitable for low temperature and low pressure die-attach bonding were developed to enable sintering at 275 °C under N2 atmosphere. First, brass flakes were treated with HCl to selectively etch Zn and to realize enhanced surface modifications on the flakes. Then, polyethylene glycol was...

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Bibliographic Details
Published in:Journal of alloys and compounds 2020-12, Vol.844, p.156043, Article 156043
Main Authors: Bhogaraju, Sri Krishna, Conti, Fosca, Kotadia, Hiren R., Keim, Simon, Tetzlaff, Ulrich, Elger, Gordon
Format: Article
Language:English
Subjects:
Bonding
Brasses
Copper
Copper oxides
Electronic packaging
Flakes
Low pressure
Low temperature
Metals and alloys
Microelectronics
Microstructure
Pastes
Polyethylene glycol
Shear strength
Sintering
Surfaces and interfaces
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Summary:Copper pastes suitable for low temperature and low pressure die-attach bonding were developed to enable sintering at 275 °C under N2 atmosphere. First, brass flakes were treated with HCl to selectively etch Zn and to realize enhanced surface modifications on the flakes. Then, polyethylene glycol was added as binder to the modified flakes due to its reducing effects on copper oxides and its property to prevent agglomeration. Shear strength of ca. 50 MPa was achieved while sintering with 10 MPa bonding pressure thereby providing suitable, easy and low-cost sintering pastes for microelectronics packaging applications.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2020.156043