Efficient Fabrication Process of Metal Nanodot Arrays Using Direct Nanoimprinting Method with a Polymer Mold

A new fabrication process of metal nanodot arrays using the thermal dewetting method was developed in this study. This process was comprised of three steps: thin Au film deposition on a quartz glass substrate, groove patterning by direct nanoimprinting, and self-organization of metal nanodot arrays...

Full description

Saved in:
Bibliographic Details
Published in:International journal of automation technology 2015-11, Vol.9 (6), p.629-635
Main Authors: Potejanasak, Potejana, Yoshino, Masahiko, Terano, Motoki, Mita, Masahiro
Format: Article
Language:English
Subjects:
Arrays
Drying
Embossing
Glass substrates
Grooves
Molds
Patterning
Polymer films
Polymers
Polyolefins
Quartz
Silica glass
Silicon wafers
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A new fabrication process of metal nanodot arrays using the thermal dewetting method was developed in this study. This process was comprised of three steps: thin Au film deposition on a quartz glass substrate, groove patterning by direct nanoimprinting, and self-organization of metal nanodot arrays by thermal dewetting. A new idea to utilize a polymer film mold for groove patterning by direct nanoimprinting was examined. The polymer film mold was prepared by hot-embossing groove patterns of a mother mold on a cyclo olefin polymer (COP) film. The mother mold was prepared from a silicon wafer. The polymer film mold was used for direct nanoimprinting on a metal film deposited on a quartz substrate. The experimental results revealed that the COP film mold can effectively form a micro groove pattern on the Au film despite the COP film mold being softer than the Au film. The micro groove on the Au film was also found to be effective in aligning the nanodots in lines. The micro groove patterning using the COP film mold was also confirmed to be useful in controlling the dot size and alignment during the thermal dewetting process.
ISSN:1881-7629
1883-8022
DOI:10.20965/ijat.2015.p0629