Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop

•New open manifold microchannel heat sink for high heat flux electronics cooling.•Open modification reduces pressure drop by 25 % with comparable thermal performance.•3D conjugate heat transfer model of a fully resolved manifold microchannel heat sink.•Flow uniformity critical to thermal performance...

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Bibliographic Details
Published in:International journal of heat and mass transfer 2020-12, Vol.163, p.120395, Article 120395
Main Authors: Gilmore, Nicholas, Timchenko, Victoria, Menictas, Chris
Format: Article
Language:English
Subjects:
Chamfering
Cooling
Electronics cooling
Flow resistance
Flow velocity
Geometry
Heat flux
Heat sink
Heat sinks
Heat transfer
Jet impingement
Manifold
Manifolds (mathematics)
Microchannel
Microchannels
Nozzles
Optimization
Pressure drop
Thermal energy
Thermal resistance
Three dimensional models
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Summary:•New open manifold microchannel heat sink for high heat flux electronics cooling.•Open modification reduces pressure drop by 25 % with comparable thermal performance.•3D conjugate heat transfer model of a fully resolved manifold microchannel heat sink.•Flow uniformity critical to thermal performance, stagnation at higher flow rates. To meet the intensifying demands of electronics cooling the current study proposes an open manifold microchannel heat sink, which substantially reduces the pressure drop of a conventional manifold microchannel heat sink while retaining a low thermal resistance, thin profile (
ISSN:0017-9310
1879-2189
DOI:10.1016/j.ijheatmasstransfer.2020.120395