Tailoring precipitation strategy to optimize microstructural evolution, aging hardening and creep resistance in an Al–Cu–Sc alloy by isochronal aging

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2020-09, Vol.795, p.139943, Article 139943
• Main Authors: Gao, Y.H., Kuang, J., Zhang, J.Y., Liu, G., Sun, J.
• Format: Article
• Language: English
• Subjects: Aging; Aging (metallurgy); Al alloys; Alloys; Aluminum base alloys; Chemical precipitation; Copper; Copper base alloys; Creep resistance; Creep strength; High temperature; Isochronal aging; Low temperature; Microalloying; Precipitates; Precipitation; Sc microalloying; Scandium
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2020.139943

Sc microalloying has been regarded as one of the most effective methods to improve the high-temperature resistance of Al-based alloys via additional Al3Sc precipitation. However, synergetic precipitation of Al3Sc and some conventional precipitates (i.e. θ′-Al2Cu) is usually difficult in traditional series Al alloys due to the huge temperature gaps between their formation, which limits the Sc microalloying effect in multicomponent systems. Here, an optimized isochronal aging strategy was illustrated in an Al–Cu-Sc alloy to achieve better ambient- and high-temperature properties in comparison to the artificially aged counterparts. A series of microstructural characterizations reveal that, upon isochronal aging, the Sc-rich entities preferentially form in regions adjacent to θ′-Al2Cu precipitates at relatively low temperature stage (~250 °C) and are responsible for refining the θ′-Al2Cu precipitation in Al–Cu-Sc alloy. At higher aging temperature (~300 °C), the preferentially formed Sc-rich entities will be collected by adjacent pre-existing θ′-Al2Cu precipitates, accompanying with additional Al3Sc formation in matrix. The coexistence of θ′-Al2Cu and Al3Sc precipitates realized by isochronal aging contributes to the improved aging hardening behavior as well as better creep resistance at 300 °C in Al–Cu-Sc alloy compared with its Sc-free or isothermally aged counterparts. [Display omitted]