Liquid-State Interfacial Reactions of Sn and Sn-Ag-Cu Solders with p-Type (Bi,Sb)2Te3 Thermoelectric Material

Liquid-state interfacial reactions of p -type (Bi,Sb) 2 Te 3 thermoelectric (TE) material with Sn and Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC305) solders, respectively, were examined at 250°C on a commercial highly orientated (Bi,Sb) 2 Te 3 substrate with a (110) soldering plane. For the reactions with Sn, th...

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Bibliographic Details
Published in:JOM (1989) 2020-10, Vol.72 (10), p.3558-3566
Main Authors: Wang, Chao-hong, Li, Mei-hau, Chiu, Chun-wei, Wang, Xin-He
Format: Article
Language:English
Subjects:
Aging
Alloys
Antimony
Bismuth
Bridgman method
Chemistry/Food Science
Copper
Cracks
Earth Sciences
Engineering
Environment
Etching
Interface reactions
Interfacial Stability in Multi-component Systems
Intermetallic compounds
Investigations
Microstructure
Physics
Reaction control
Silver
Soldering
Solders
Substrates
Thermoelectric materials
Thermoelectricity
Tin
Tin base alloys
Tin tellurides
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Summary:Liquid-state interfacial reactions of p -type (Bi,Sb) 2 Te 3 thermoelectric (TE) material with Sn and Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC305) solders, respectively, were examined at 250°C on a commercial highly orientated (Bi,Sb) 2 Te 3 substrate with a (110) soldering plane. For the reactions with Sn, the initial reaction phase was the porous SnTe intermetallic compound (IMC). Then, a dense SnTe layer with many tiny cracks formed between the porous phase and TE substrate. With longer aging time, the dense SnTe gradually changed to the porous phase due to Sb dissolution. In the subsequent stage, the reaction phase zone included porous SnTe, an alternating layer microstructure of SnTe and liquid solder, and SnTe/Sn 3 Sb 2 alternating layers from the solder to TE. The IMC growth was extremely fast, being approximately 15  μ m/min, and nearly linear with aging time, suggesting reaction control. For the reactions with SAC305, a similar microstructure of porous SnTe and the dense layer was observed. Compared with the reactions with Sn, however, the IMC growth rate was greatly suppressed by ~ 80%. This can be attributed to the Ag-rich phase layer between the dense SnTe and (Bi,Sb) 2 Te 3 . Ag was verified to be the key element for dramatically changing the interfacial reaction behavior.
ISSN:1047-4838
1543-1851
DOI:10.1007/s11837-020-04288-0