Compression Brazing of SiCp/Al Composite Using a Semisolid Zn-Al-Cu Filler Metal Based on the Strain-Induced Melt Activation Process

The compression brazing of SiC p /Al composite using a semisolid Zn-Al-Cu filler metal based on the strain-induced melt activation process was performed. The as-rolled filler metal was placed between pieces of SiC p /Al composite and heated to the semisolid temperature range for 20 min to spheroidiz...

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Bibliographic Details
Published in:JOM (1989) 2019-12, Vol.71 (12), p.4931-4939
Main Authors: Xiao, Jing, Li, Shun, Bai, Shuxin, Yan, Jiuchun, Xiong, Degan, Tang, Yu
Format: Article
Language:English
Subjects:
Aluminum
Bonded joints
Brazing
Chemistry/Food Science
Copper
Earth Sciences
Engineering
Environment
Filler metals
Grains
Hot rolling
Interdiffusion
Microscopy
Microstructure
Oxide coatings
Physics
Semisolids
Shear strength
Shear tests
Spheroidizing
Technical Article
Temperature
Zinc
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Summary:The compression brazing of SiC p /Al composite using a semisolid Zn-Al-Cu filler metal based on the strain-induced melt activation process was performed. The as-rolled filler metal was placed between pieces of SiC p /Al composite and heated to the semisolid temperature range for 20 min to spheroidize the solid grains of the filler. Subsequent compression caused the solid grains to compress and slide to the SiC p /Al composite surface. This disrupted the oxide film on the composite surface and promoted interdiffusion between the filler and SiC p /Al composite, forming a metallurgically bonded joint upon cooling. The optimum spherical microstructure of the filler metal was obtained at 392°C, resulting in intense solid grain sliding during compression among the samples considered in this study. A significant disruption of the oxide film was observed at 392°C, and the joint showed shear strength of 105 MPa, reaching 78% of that of the base materials.
ISSN:1047-4838
1543-1851
DOI:10.1007/s11837-019-03791-3