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Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure
The conductive and transparent properties of ZnO/Cu/ZnO sandwich structures were investigated in this study. The I – V curves of single ZnO films with different thicknesses were recorded and plotted. The linear I – V curves confirmed the ohmic conduction mechanism for the ZnO thin films in the ZnO/C...
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Published in: | Journal of electronic materials 2021-03, Vol.50 (3), p.779-785 |
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container_title | Journal of electronic materials |
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creator | Chen, Wei-Hao Chou, Chia-Yueh Li, Bao-Jhen Yeh, Ching-Yu Huang, Bo-Rong Hsu, Mao-Feng Chung, Sheng-Feng Liu, Cheng-Yi |
description | The conductive and transparent properties of ZnO/Cu/ZnO sandwich structures were investigated in this study. The
I
–
V
curves of single ZnO films with different thicknesses were recorded and plotted. The linear
I
–
V
curves confirmed the ohmic conduction mechanism for the ZnO thin films in the ZnO/Cu/ZnO sandwich structures. Moreover, the energy band diagram of the ZnO/Cu interface showed that the interface between ZnO and Cu exhibited ohmic contact behavior. The resistivity of the ZnO/Cu/ZnO sandwich structures (with thicknesses between 20/5/20 nm and 80/5/80 nm) ranged from 2.25 × 10
−4
Ω cm to 9.72 × 10
−4
Ω cm. The lowest resistivity (i.e., 2.25 × 10
−4
Ω cm) occurred in the 20/5/20 nm thin film. In the ZnO/Cu/ZnO sandwich structures, the electrons are transported vertically through the upper ZnO thin film and transported horizontally in the sandwiched Cu thin film. Ohmic conduction behavior was verified throughout the conduction path in the ZnO/Cu/ZnO sandwich structure. The transmittance measurement in the visible region of the structures showed that the sandwiched ZnO layers increased the transmittance of the 5 nm Cu thin film. In addition, the transmittance of the ZnO/Cu/ZnO sandwich structure was dependent on the thickness of the sandwiched ZnO layers. The 60/5/60 nm sandwich structure exhibited the best enhancement effect on transmittance. The thickness dependence was found to be due to the destructive interference between the reflected light at the ZnO/Cu and Cu/ZnO interfaces in the ZnO/Cu/ZnO sandwich structures. |
doi_str_mv | 10.1007/s11664-020-08471-6 |
format | article |
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I
–
V
curves of single ZnO films with different thicknesses were recorded and plotted. The linear
I
–
V
curves confirmed the ohmic conduction mechanism for the ZnO thin films in the ZnO/Cu/ZnO sandwich structures. Moreover, the energy band diagram of the ZnO/Cu interface showed that the interface between ZnO and Cu exhibited ohmic contact behavior. The resistivity of the ZnO/Cu/ZnO sandwich structures (with thicknesses between 20/5/20 nm and 80/5/80 nm) ranged from 2.25 × 10
−4
Ω cm to 9.72 × 10
−4
Ω cm. The lowest resistivity (i.e., 2.25 × 10
−4
Ω cm) occurred in the 20/5/20 nm thin film. In the ZnO/Cu/ZnO sandwich structures, the electrons are transported vertically through the upper ZnO thin film and transported horizontally in the sandwiched Cu thin film. Ohmic conduction behavior was verified throughout the conduction path in the ZnO/Cu/ZnO sandwich structure. The transmittance measurement in the visible region of the structures showed that the sandwiched ZnO layers increased the transmittance of the 5 nm Cu thin film. In addition, the transmittance of the ZnO/Cu/ZnO sandwich structure was dependent on the thickness of the sandwiched ZnO layers. The 60/5/60 nm sandwich structure exhibited the best enhancement effect on transmittance. The thickness dependence was found to be due to the destructive interference between the reflected light at the ZnO/Cu and Cu/ZnO interfaces in the ZnO/Cu/ZnO sandwich structures.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-020-08471-6</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Contact resistance ; Electrical resistivity ; Electronics and Microelectronics ; Emerging Interconnection Technology ; Energy bands ; Instrumentation ; Interconnect ; Materials Science ; Optical and Electronic Materials ; Pb-free Solder ; Photovoltaic cells ; Sandwich structures ; Solid State Physics ; Thickness ; Thin films ; TMS2020 Advanced Microelectronic Packaging ; TMS2020 Microelectronic Packaging ; Transmittance ; Zinc oxide</subject><ispartof>Journal of electronic materials, 2021-03, Vol.50 (3), p.779-785</ispartof><rights>The Minerals, Metals & Materials Society 2020</rights><rights>The Minerals, Metals & Materials Society 2020.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-3047da045bc84234e2146ede421db47094b3bf4fe8a8c1689f0bf13f24894a6a3</citedby><cites>FETCH-LOGICAL-c319t-3047da045bc84234e2146ede421db47094b3bf4fe8a8c1689f0bf13f24894a6a3</cites><orcidid>0000-0002-0930-2609</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Chen, Wei-Hao</creatorcontrib><creatorcontrib>Chou, Chia-Yueh</creatorcontrib><creatorcontrib>Li, Bao-Jhen</creatorcontrib><creatorcontrib>Yeh, Ching-Yu</creatorcontrib><creatorcontrib>Huang, Bo-Rong</creatorcontrib><creatorcontrib>Hsu, Mao-Feng</creatorcontrib><creatorcontrib>Chung, Sheng-Feng</creatorcontrib><creatorcontrib>Liu, Cheng-Yi</creatorcontrib><title>Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>The conductive and transparent properties of ZnO/Cu/ZnO sandwich structures were investigated in this study. The
I
–
V
curves of single ZnO films with different thicknesses were recorded and plotted. The linear
I
–
V
curves confirmed the ohmic conduction mechanism for the ZnO thin films in the ZnO/Cu/ZnO sandwich structures. Moreover, the energy band diagram of the ZnO/Cu interface showed that the interface between ZnO and Cu exhibited ohmic contact behavior. The resistivity of the ZnO/Cu/ZnO sandwich structures (with thicknesses between 20/5/20 nm and 80/5/80 nm) ranged from 2.25 × 10
−4
Ω cm to 9.72 × 10
−4
Ω cm. The lowest resistivity (i.e., 2.25 × 10
−4
Ω cm) occurred in the 20/5/20 nm thin film. In the ZnO/Cu/ZnO sandwich structures, the electrons are transported vertically through the upper ZnO thin film and transported horizontally in the sandwiched Cu thin film. Ohmic conduction behavior was verified throughout the conduction path in the ZnO/Cu/ZnO sandwich structure. The transmittance measurement in the visible region of the structures showed that the sandwiched ZnO layers increased the transmittance of the 5 nm Cu thin film. In addition, the transmittance of the ZnO/Cu/ZnO sandwich structure was dependent on the thickness of the sandwiched ZnO layers. The 60/5/60 nm sandwich structure exhibited the best enhancement effect on transmittance. The thickness dependence was found to be due to the destructive interference between the reflected light at the ZnO/Cu and Cu/ZnO interfaces in the ZnO/Cu/ZnO sandwich structures.</description><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Contact resistance</subject><subject>Electrical resistivity</subject><subject>Electronics and Microelectronics</subject><subject>Emerging Interconnection Technology</subject><subject>Energy bands</subject><subject>Instrumentation</subject><subject>Interconnect</subject><subject>Materials Science</subject><subject>Optical and Electronic Materials</subject><subject>Pb-free Solder</subject><subject>Photovoltaic cells</subject><subject>Sandwich structures</subject><subject>Solid State Physics</subject><subject>Thickness</subject><subject>Thin films</subject><subject>TMS2020 Advanced Microelectronic Packaging</subject><subject>TMS2020 Microelectronic Packaging</subject><subject>Transmittance</subject><subject>Zinc oxide</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><recordid>eNp9kE9LxDAQR4MouK5-AU8Fz3VnkmmaHmXxHyyssCuIl5C2iXbRtiat4rc3WsGbp7m89xt4jJ0inCNAvgiIUlIKHFJQlGMq99gMMxIpKvmwz2YgJKYZF9khOwphB4AZKpyxq2XX1mM1NO82MW2dbL1pQ2-8bYfkzne99UNjQ9K55LFdL5bjIp5kE8mPpnpONoOP7ujtMTtw5iXYk987Z_dXl9vlTbpaX98uL1ZpJbAYUgGU1wYoKytFXJDlSNLWljjWJeVQUClKR84qoyqUqnBQOhSOkyrISCPm7Gza7X33Ntow6F03-ja-1JwKIOC5xEjxiap8F4K3Tve-eTX-UyPo71566qVjL_3TS8soiUkKEW6frP-b_sf6An5CbMY</recordid><startdate>20210301</startdate><enddate>20210301</enddate><creator>Chen, Wei-Hao</creator><creator>Chou, Chia-Yueh</creator><creator>Li, Bao-Jhen</creator><creator>Yeh, Ching-Yu</creator><creator>Huang, Bo-Rong</creator><creator>Hsu, Mao-Feng</creator><creator>Chung, Sheng-Feng</creator><creator>Liu, Cheng-Yi</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope><orcidid>https://orcid.org/0000-0002-0930-2609</orcidid></search><sort><creationdate>20210301</creationdate><title>Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure</title><author>Chen, Wei-Hao ; Chou, Chia-Yueh ; Li, Bao-Jhen ; Yeh, Ching-Yu ; Huang, Bo-Rong ; Hsu, Mao-Feng ; Chung, Sheng-Feng ; Liu, Cheng-Yi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-3047da045bc84234e2146ede421db47094b3bf4fe8a8c1689f0bf13f24894a6a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Contact resistance</topic><topic>Electrical resistivity</topic><topic>Electronics and Microelectronics</topic><topic>Emerging Interconnection Technology</topic><topic>Energy bands</topic><topic>Instrumentation</topic><topic>Interconnect</topic><topic>Materials Science</topic><topic>Optical and Electronic Materials</topic><topic>Pb-free Solder</topic><topic>Photovoltaic cells</topic><topic>Sandwich structures</topic><topic>Solid State Physics</topic><topic>Thickness</topic><topic>Thin films</topic><topic>TMS2020 Advanced Microelectronic Packaging</topic><topic>TMS2020 Microelectronic Packaging</topic><topic>Transmittance</topic><topic>Zinc oxide</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, Wei-Hao</creatorcontrib><creatorcontrib>Chou, Chia-Yueh</creatorcontrib><creatorcontrib>Li, Bao-Jhen</creatorcontrib><creatorcontrib>Yeh, Ching-Yu</creatorcontrib><creatorcontrib>Huang, Bo-Rong</creatorcontrib><creatorcontrib>Hsu, Mao-Feng</creatorcontrib><creatorcontrib>Chung, Sheng-Feng</creatorcontrib><creatorcontrib>Liu, Cheng-Yi</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni)</collection><collection>ProQuest Central</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>AUTh Library subscriptions: ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>https://resources.nclive.org/materials</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library (ProQuest)</collection><collection>Science Database (ProQuest)</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chen, Wei-Hao</au><au>Chou, Chia-Yueh</au><au>Li, Bao-Jhen</au><au>Yeh, Ching-Yu</au><au>Huang, Bo-Rong</au><au>Hsu, Mao-Feng</au><au>Chung, Sheng-Feng</au><au>Liu, Cheng-Yi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2021-03-01</date><risdate>2021</risdate><volume>50</volume><issue>3</issue><spage>779</spage><epage>785</epage><pages>779-785</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><abstract>The conductive and transparent properties of ZnO/Cu/ZnO sandwich structures were investigated in this study. The
I
–
V
curves of single ZnO films with different thicknesses were recorded and plotted. The linear
I
–
V
curves confirmed the ohmic conduction mechanism for the ZnO thin films in the ZnO/Cu/ZnO sandwich structures. Moreover, the energy band diagram of the ZnO/Cu interface showed that the interface between ZnO and Cu exhibited ohmic contact behavior. The resistivity of the ZnO/Cu/ZnO sandwich structures (with thicknesses between 20/5/20 nm and 80/5/80 nm) ranged from 2.25 × 10
−4
Ω cm to 9.72 × 10
−4
Ω cm. The lowest resistivity (i.e., 2.25 × 10
−4
Ω cm) occurred in the 20/5/20 nm thin film. In the ZnO/Cu/ZnO sandwich structures, the electrons are transported vertically through the upper ZnO thin film and transported horizontally in the sandwiched Cu thin film. Ohmic conduction behavior was verified throughout the conduction path in the ZnO/Cu/ZnO sandwich structure. The transmittance measurement in the visible region of the structures showed that the sandwiched ZnO layers increased the transmittance of the 5 nm Cu thin film. In addition, the transmittance of the ZnO/Cu/ZnO sandwich structure was dependent on the thickness of the sandwiched ZnO layers. The 60/5/60 nm sandwich structure exhibited the best enhancement effect on transmittance. The thickness dependence was found to be due to the destructive interference between the reflected light at the ZnO/Cu and Cu/ZnO interfaces in the ZnO/Cu/ZnO sandwich structures.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11664-020-08471-6</doi><tpages>7</tpages><orcidid>https://orcid.org/0000-0002-0930-2609</orcidid></addata></record> |
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subjects | Characterization and Evaluation of Materials Chemistry and Materials Science Contact resistance Electrical resistivity Electronics and Microelectronics Emerging Interconnection Technology Energy bands Instrumentation Interconnect Materials Science Optical and Electronic Materials Pb-free Solder Photovoltaic cells Sandwich structures Solid State Physics Thickness Thin films TMS2020 Advanced Microelectronic Packaging TMS2020 Microelectronic Packaging Transmittance Zinc oxide |
title | Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure |
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