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Formability analysis of electrically assisted double-side multi-point incremental sheet forming
Double-side multi-point incremental forming (DMISF) process combines local and progressive forming features with the advantages such as high forming precision, high production flexibility, and high fracture limit, so it is suitable to form complex aerospace parts and difficult-to-shape materials. Hi...
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Published in: | International journal of advanced manufacturing technology 2020-06, Vol.108 (11-12), p.3405-3417 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Double-side multi-point incremental forming (DMISF) process combines local and progressive forming features with the advantages such as high forming precision, high production flexibility, and high fracture limit, so it is suitable to form complex aerospace parts and difficult-to-shape materials. High-strength aluminum alloy is widely used in aerospace fields, but its poor formability at room temperature limits its further development. Pulse current was introduced into DMISF process to improve the formability of high-strength aluminum alloy. So equipment for electrically assisted double-side multi-point incremental sheet forming (E-DMISF) process was set up. However, the E-DMISF process is a complicated electro-thermal-structure multi-field coupling process; the flow of the material in the forming process is very complicated. In this research, the hyperbolic truncated cone and hyperbolic truncated pyramid were chosen as study objects and the stress triaxiality was selected as the characteristic function of ductile fracture criterion. Based on all above, the fracture limit experiments and simulation in the E-DMISF process were performed and the fracture criterion was established correspondingly. The result indicates that the electric field could help enhance the fracture limit effectively. |
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ISSN: | 0268-3768 1433-3015 |
DOI: | 10.1007/s00170-020-05576-4 |