Loading…

Open-source wire and arc additive manufacturing system: formability, microstructures, and mechanical properties

The inexpensive cost and high manufacture efficient metal wire and arc additive manufacturing (WAAM) system was designed in this work. Its application potential was evaluated from the three aspects of formability, microstructures, and mechanical properties. By using compulsory cooling solution imple...

Full description

Saved in:
Bibliographic Details
Published in:International journal of advanced manufacturing technology 2017-11, Vol.93 (5-8), p.2145-2154
Main Authors: Lu, X., Zhou, Y. F., Xing, X. L., Shao, L. Y., Yang, Q. X., Gao, S. Y.
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The inexpensive cost and high manufacture efficient metal wire and arc additive manufacturing (WAAM) system was designed in this work. Its application potential was evaluated from the three aspects of formability, microstructures, and mechanical properties. By using compulsory cooling solution implemented in the open-source WAAM system, the complex-shaped metal parts were deposited completely with no obvious defects, such as cracks, pores, or incomplete fusion. The properties of the WAAM part were evaluated by optical microscopy (OM), scanning electron microscopy (SEM), microhardness, and microtensile test. The results indicate that the formability of metal parts fabricated by the open-source WAAM system was improved by using compulsory cooling solution. The microstructures of the WAAM part are exhibited as granular structure which consisted of the granular ferrite and the residual austenite interspersed with a little pearlite in the intermediate zone. And the average ferrite grain size of non-overlapping layer is relatively smaller than that of overlapping layer. The specimen perpendicular to the building direction exhibits a better mechanical property.
ISSN:0268-3768
1433-3015
DOI:10.1007/s00170-017-0636-z