Improvements of the structural, thermal, and mechanical properties of structural adhesive with functionalized boron nitride nanoparticles

• Published in: Journal of applied polymer science 2021-06, Vol.138 (21), p.n/a
• Main Authors: Gültekin, Kürşat, Uğuz, Gediz, Özel, Adnan
• Format: Article
• Language: English
• Subjects: Adhesives; Aminopropyltriethoxysilane; Boron; Boron compounds; Boron nitride; Boron-epoxy composites; composites; Differential scanning calorimetry; Dynamic mechanical analysis; Fourier transforms; Infrared analysis; Materials science; Mechanical properties; Nanoparticles; nanowires and nanocrystals; Physical properties; Polymer matrix composites; Polymers; Spectrum analysis; Tensile tests; thermal properties; Thermodynamic properties; Thermogravimetric analysis
• ISSN: 0021-8995; 1097-4628
• DOI: 10.1002/app.50491

Investigations on the production and development of nanoparticle‐reinforced polymer materials have been attracted attention by researchers. Various nanoparticles have been used to improve the mechanical, chemical, thermal, and physical properties of polymer matrix composites. Boron compounds come to the fore to improve the mechanical and thermal properties of polymers. In this study, mechanical, thermal, and structural properties of structural adhesive have been examined by adding nano hexagonal boron nitride (h‐BN) to epoxy matrix at different percentages (0.5, 1, 2, 3, 4, and 5%). For this purpose, nano h‐BN particles were functionalized with 3‐aminopropyltriethoxysilane (APTES) to disperse the h‐BN nanoparticles homogeneously in epoxy matrix and to form a strong bond at the matrix interface. Two‐component structural epoxy adhesive was modified by using functionalized h‐BN nanoparticles. The structural and thermal properties of the modified adhesives were investigated by scanning electron microscopy and energy dispersion X‐ray spectroscopy, Fourier transform infrared spectroscopy, differential scanning calorimetry, and thermogravimetric analysis techniques. Tensile test and dynamic mechanical analysis were performed to determine the mechanical properties of the adhesives. When the results obtained from analysis were examined, it was seen that the nano h‐BN particles functionalized with APTES were homogeneously dispersed in the epoxy matrix and formed a strong bond. In addition that, it was concluded from the experimental results that the thermal and mechanical properties of adhesives were improved by adding functionalized nano h‐BN particles into epoxy at different ratios.