Properties of an electroless copper process as a function of nickel and cyanide ion concentrations

A cyanide-stabilized electroless copper plating process with nickel as a stress-regulating additive was investigated. Small amounts of nickel or cyanide increase the deposition rate, while large amounts of cyanide decrease the deposition rate. The steady-state mixed potential shifts by – 0.23 V when...

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Bibliographic Details
Published in:Journal of applied electrochemistry 2021-05, Vol.51 (5), p.795-802
Main Authors: Brown, Delilah A., MacDonald, Alex R., McCarron, Eamon A., Zarwell, Sebastian, Bernhard, Tobias, Brüning, Ralf
Format: Article
Language:English
Subjects:
Chemistry
Chemistry and Materials Science
Copper
Copper plating
Cyanide process
Deposition
Electrochemistry
Electrodeposition
Electroless copper plating
Electroless plating
Industrial Chemistry/Chemical Engineering
Nickel
Physical Chemistry
Research Article
Steady state
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Summary:A cyanide-stabilized electroless copper plating process with nickel as a stress-regulating additive was investigated. Small amounts of nickel or cyanide increase the deposition rate, while large amounts of cyanide decrease the deposition rate. The steady-state mixed potential shifts by – 0.23 V when about 0.05 at.% nickel is co-plated with copper. Cyanide by itself does not change the mixed potential. If nickel is also present, cyanide causes an anodic shift by + 0.09 V. Nickel changes the stress during deposition towards tensile, while cyanide changes it towards compressive. Both nickel and cyanide accelerate the transition to steady-state plating conditions. Graphic Abstract
ISSN:0021-891X
1572-8838
DOI:10.1007/s10800-021-01535-3