Plasma deposition of a stable SiOx‐like layer on copper surface for enhanced pool boiling heat transfer performance: A combination of microstructures and wetting properties

• Published in: Plasma processes and polymers 2021-04, Vol.18 (4), p.n/a
• Main Authors: Mohammadi, Hamid R., Taghvaei, Hamed, Rabiee, Ataollah
• Format: Article
• Language: English
• Subjects: Boiling; Chemical vapor deposition; Contact angle; Copper; critical heat flux; Heat transfer coefficients; Morphology; nonthermal plasma; Plasma deposition; pool boiling; silicon oxides; Thin films; Wettability; Wetting
• ISSN: 1612-8850; 1612-8869
• DOI: 10.1002/ppap.202000209

In this study, a thin film composed of inorganic SiOx is deposited on the copper surface by atmospheric pressure plasma‐enhanced chemical vapor deposition. A pool boiling experiment is performed and the influence of the coating on pool boiling performance is examined. Morphology, composition, and wettability of the thin films are assessed using a scanning electron microscope, energy‐dispersive X‐ray spectrometer, and contact angle measurements. In addition to the enhancement of pool boiling thermal characteristics, especially a 103% increase in heat transfer coefficient, it is observed that the plasma‐deposited thin film on the copper surface is stable after the four boiling/cooling cycles. Finally, the underlying mechanism behind the improvements achieved by use of coated surface is studied. Boiling parameters over the SiOx‐like coated copper surface are studied. A stable thin film is deposited on the copper surface using atmospheric pressure plasma. There is an enhancement of pool boiling thermal characteristics, especially 103% growth in heat transfer coefficient