Manifold microchannel heat sink topology optimisation

• Published in: International journal of heat and mass transfer 2021-05, Vol.170, p.121025, Article 121025
• Main Authors: Gilmore, Nicholas, Timchenko, Victoria, Menictas, Chris
• Format: Article
• Language: English
• Subjects: Constrictions; Coolers; Electronics cooling; Heat flux; Heat sink; Heat sinks; Heat transfer; Jet impingement; Manifold; Manifolds (mathematics); Microchannel; Microchannels; Multiple objective analysis; Nozzles; Pressure drop; Thermal resistance; Topology optimisation; Topology optimization
• ISSN: 0017-9310; 1879-2189
• DOI: 10.1016/j.ijheatmasstransfer.2021.121025

•New manifold microchannel heat sink structures via 3D topology optimisation.•Structures reduce pressure drop 17 % by suppressing stagnation regions.•Structures reduce pressure drop by 79 % by opening nozzle constrictions.•Structures reduce thermal resistance by 22 % via jets and streamwise heating. This study generates novel manifold microchannel heat sink structures for high heat flux cooling, by applying topology optimisation within a multi-objective 3D conjugate heat transfer model. Compared to rectangular manifold microchannels, the proposed structures reduce pressure drop by 17 % (7.2 kPa - 6.0 kPa) by suppressing stagnation regions, and a more substantial 79.2 % (5.8 kPa - 1.2 kPa) by also limiting nozzle constrictions. This structure simultaneously reduces thermal resistance by 22.4 % (0.148 W/cm2K – 0.115 W/cm2K) by introducing intricate pins and constrictions, which augment jet impingement and counteract streamwise heating of the fluid. This study reveals some topology optimisation deficiencies: manual tuning of conditions, penetration of fluid to solid, and discrete geometry extraction. However, the resulting structures demonstrate how the topology optimisation process may leverage advances in additive manufacturing to extend the capabilities of high heat flux coolers.