Expansion of the Beamforming Coverage Area in an Elevation Plane for 60 GHz Band 3-D Beamforming

This letter proposes a novel antenna structure for 60  GHz band 3-D coverage beamforming. By using the proposed antenna structure, the coverage area can be expanded in an elevation plane. Dipole and patch subarray antennas were packaged into one structure by using the copper balls interconnection te...

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Bibliographic Details
Published in:IEEE antennas and wireless propagation letters 2021-05, Vol.20 (5), p.773-777
Main Authors: Yoshida, Satoshi, Motoyoshi, Mizuki, Kameda, Suguru, Suematsu, Noriharu, Nishikawa, Kenjiro
Format: Article
Language:English
Subjects:
60 GHz
Antenna arrays
Antennas
Array signal processing
Beamforming
Copper
Dipole antennas
Dipoles
millimeter-wave
Mixers
packaging and interconnects
Phased arrays
phased-array antenna
planar antenna
Substrates
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Summary:This letter proposes a novel antenna structure for 60  GHz band 3-D coverage beamforming. By using the proposed antenna structure, the coverage area can be expanded in an elevation plane. Dipole and patch subarray antennas were packaged into one structure by using the copper balls interconnection technique. A simple idea to utilize dipole and patch elements enables endfire and broadside radiations resulting in the coverage area expansion in the elevation plane. Two 2 × 4 array antennas were made up of eight multilayered substrate. Six metal layers were used for each multilayered substrate.
ISSN:1536-1225
1548-5757
DOI:10.1109/LAWP.2021.3063098