Systematic Design for Mitigation of RF Desense by Interleaved Power Line in Two-Layer PCB

The RF desense problem in wireless products becomes serious due to faster digital signals and minimal area in print circuit boards (PCBs). This article proposes a systematic design of interleaved power transmission lines to suppress electromagnetic interference due to magnetic coupling from the powe...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2021-05, Vol.11 (5), p.859-864
Main Authors: Huang, Chun-Ming, Wang, Shih-Hung, Wu, Ting-Ying, Huang, Ming-Chung, Wu, Ruey-Beei
Format: Article
Language:English
Subjects:
Circuit boards
Circuit design
Couplings
Digital electronics
Electromagnetic interference
Electromagnetic interference (EMI)
Inductance
Integrated circuit modeling
Layout
magnetic coupling
Magnetic flux
Packaging
Power lines
power transmission line
Power transmission lines
print circuit board (PCB)
Printed circuits
Substrates
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Description
Summary:The RF desense problem in wireless products becomes serious due to faster digital signals and minimal area in print circuit boards (PCBs). This article proposes a systematic design of interleaved power transmission lines to suppress electromagnetic interference due to magnetic coupling from the power delivery system of digital circuits to RF components. It improves noise suppression by more than 20 dB, in only two-layer PCB, with one power trace and three enclosing grounds to replace the conventional power trace in the same occupied area. A general design chart of isolation improvement versus trace width, spacing, and substrate thickness is constructed. Finally, the proposed concept is verified by experiment and simulation.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2021.3063321