Electrical Activation of Polymer Reny1002H Surface with Laser Irradiation for Molded Interconnect Devices

Polymers Reny 1002H blended with 3% by weight Merck Iriotec 8841 (dicopper hydroxide phosphate) after injection molding was irradiated using a C[O.sub.2 ]laser, and followed by copper electroless plating. It has been clearly observed that the surface activation was determined by the interaction leve...

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Bibliographic Details
Published in:Journal of laser micro nanoengineering 2021-04, Vol.16 (1), p.68-73
Main Authors: Huang, Gang, Wang, Hailun, Wang, Zhongke, Lim, Paul, Wan, Yin Chi, Zhou, Yujie
Format: Article
Language:English
Subjects:
Analysis
Carbon dioxide
Carbon dioxide lasers
Copper
Copper plating
Electric properties
Electrical resistance
Hydroxides
Injection molding
Irradiation
Laser applications
Lasers
Manufacturing
Pharmaceutical industry
Phosphates
Polymers
Scanning
Sulfuric acid
Surface activation
Surface structure
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Summary:Polymers Reny 1002H blended with 3% by weight Merck Iriotec 8841 (dicopper hydroxide phosphate) after injection molding was irradiated using a C[O.sub.2 ]laser, and followed by copper electroless plating. It has been clearly observed that the surface activation was determined by the interaction level between laser and resin material, namely laser power, scanning speed and line hatching pitch. With increasing laser scanning speed, naturally the modification level was reduced, and electrical resistance was reduced. Line pitch played a similar function to scanning speed. At increasing line hatch spacing, close or larger than the laser spot size, the surface was not able to be modified uniformly. Electrical resistance decreased at a higher modification level with high laser power. SEM analysis disclosed that the copper plated surface was a porous surface structure. The lowest electrical resistance 0.043 Ohms at laser power of 18W, spot size of 200 [micro]m, hatching pitch of 150 [micro]m and scanning speed of 150 mm/s. The calculated electrical resistivity was 1.62 X [10.sup.-7] [OMEGA]m which was one order of magnitude lower than the bulk copper of 1.72 X [10.sup.-8] [OMEGA]m due to the porous structure disclosed under scan electron microscope (SEM) and the electron dispersive X-ray spectroscopy (EDX) measurements. Keywords: surface electrical activation, polymer Reny1002H, selective laser activation, electroless plating, 3D Molded Interconnected Device, direct laser structuring
ISSN:1880-0688
1880-0688
DOI:10.2961/jlmn.2021.01.2012