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The Effect of EMI Generated from Spread-Spectrum-Modulated SiC-Based Buck Converter on the G3-PLC Channel
Power line communication (PLC) is increasingly emerging as an important communication technology for the smart-grid environment. As PLC systems use the existing infrastructure, they are always exposed to conducted electromagnetic interference (EMI) from switching mode power converters, which need to...
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Published in: | Electronics (Basel) 2021-06, Vol.10 (12), p.1416 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Power line communication (PLC) is increasingly emerging as an important communication technology for the smart-grid environment. As PLC systems use the existing infrastructure, they are always exposed to conducted electromagnetic interference (EMI) from switching mode power converters, which need to be tightly controlled to meet EMC regulations and to ensure the proper operation of the PLC system. For this purpose, spread-spectrum modulation (SSM) techniques are widely adopted to decrease the amplitude of the generated EMI from the power converters so as to comply with EMC regulations. In this paper, the influence of a spread-spectrum-modulated SiC-based buck converter on the G3-PLC channel performance is described in terms of channel capacity reduction using the Shannon–Hartley equation. The experimental setup was implemented to emulate a specific coupling path between the power and communication circuits and the channel capacity reduction was evaluated by the Shannon–Hartley equation in several operating scenarios and compared with the measured frame error rate. Based on the obtained results, SSM provides the EMI spectral peak amplitude reduction required to pass the electromagnetic compatibility (EMC) tests, but results in increased EMI-induced channel capacity degradation and increased transmission error rate in PLC systems. |
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ISSN: | 2079-9292 2079-9292 |
DOI: | 10.3390/electronics10121416 |