P‐41: Reduction and Mechanism of MOD‐Contact ESD Failure in a‐Si Product Containing PLN

In this paper, it is found that the residual of Multi Layer is the citical factors Lead to the failure of MOD contact ESD test, The cause of residual during Laser cut has been anaysised, and the mechanism has been studied, furthermore, several improvement methods has been proposed.

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Bibliographic Details
Published in:SID International Symposium Digest of technical papers 2021-05, Vol.52 (1), p.1214-1216
Main Authors: Zhang, Xia, Liang, Yuheng, Li, Lanyan, Liu, Gang, Hsieh, Chung-Ching, Xiao, Juncheng, Zhao, Bin
Format: Article
Language:English
Subjects:
Contact
MOD contact ESD
Mutilayer
Planarization Layer (PLN)
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Description
Summary:In this paper, it is found that the residual of Multi Layer is the citical factors Lead to the failure of MOD contact ESD test, The cause of residual during Laser cut has been anaysised, and the mechanism has been studied, furthermore, several improvement methods has been proposed.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.14916