Investigation on Mechanical Damage of No-Insulation REBCO Pancake Coil by Multi-Physics Quench Simulation

A no-insulation (NI) winding technique greatly improves the thermal stability of REBa 2 Cu 3 O x (RE = Rare Earth; REBCO) pancake coils. Since it has recently been pointed out that strong electromagnetic forces due to induced currents cause mechanical damage to NI REBCO coils during quench propagati...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity 2021-08, Vol.31 (5), p.1-5
Main Authors: Mori, Shumpei, Noguchi, So
Format: Article
Language:English
Subjects:
Coils (windings)
Critical current density (superconductivity)
Damage
Elastic analysis
Electromagnetic fields
Electromagnetic forces
Equivalent circuits
Finite element analysis
Finite element method
Insulation
Magnetic fields
mechanical damage
multi-physics simulation
no-insulation winding technique
Pancake coils
REBCO coil
Simulation
Strain
Strain analysis
Superconducting magnets
Thermal analysis
Thermal simulation
Thermal stability
Two dimensional analysis
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Summary:A no-insulation (NI) winding technique greatly improves the thermal stability of REBa 2 Cu 3 O x (RE = Rare Earth; REBCO) pancake coils. Since it has recently been pointed out that strong electromagnetic forces due to induced currents cause mechanical damage to NI REBCO coils during quench propagation under high magnetic field. The mechanical stability must be investigated and discussed further. We have developed a multi-physics quench simulation for NI REBCO pancake coils by combining a 2D stress/strain finite element analysis (FEA) with an electromagnetic field analysis of partial element equivalent circuit (PEEC) method and a 2D thermal FEA. The simulation results showed the consistency with the experimental results.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2021.3058538