In situ sintered silver decorated 3D structure of cellulose scaffold for highly thermoconductive electromagnetic interference shielding epoxy nanocomposites

This study presents a 3‐dimensional (3D) network structure of cellulose scaffold (CS), which was in situ decorated with silver nanoparticles (AgNPs). The scaffold was then infiltrated with epoxy matrix and cured at elevated temperature to sinter the AgNPs; finally, highly thermoconductive epoxy comp...

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Bibliographic Details
Published in:Journal of applied polymer science 2021-10, Vol.138 (40), p.n/a
Main Authors: Tran, Thi Tuong Vi, Vo, Dai‐Viet N., Nguyen, Son Thanh, Luu, Son D. N., Mofijur, M., Vu, Canh Minh
Format: Article
Language:English
Subjects:
Cellulose
composites
conducting polymers
Electrical resistivity
Electromagnetic shielding
Heat conductivity
Heat transfer
High temperature
Materials science
mechanical properties
Nanocomposites
Nanoparticles
nanostructured polymers
Polymers
Scaffolds
Silver
Thermal conductivity
thermal properties
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Summary:This study presents a 3‐dimensional (3D) network structure of cellulose scaffold (CS), which was in situ decorated with silver nanoparticles (AgNPs). The scaffold was then infiltrated with epoxy matrix and cured at elevated temperature to sinter the AgNPs; finally, highly thermoconductive epoxy composites (Ag@CS/epoxy) was obtained. The resultant Ag@CS20/epoxy composite reached a thermal conductivity of 2.52 W·m−1·K−1 at 2.2 vol% of filler loading, which shows an enhancement of over 11‐folds in the thermal conductivity compared to the neat epoxy. The superb electrical conductivity value of over 53,691 S·m−1 of the Ag@CS20/epoxy was achieved, which led to exceptional EMI SE values of 69.1 dB. Furthermore, surface temperatures during heating and cooling were also investigated to demonstrate the superior heat dissipating capacity of the Ag@CS/epoxy composite, which can be potentially put an application as thermal dissipating material in the next generation of electronics. The 3D structure of sintered silver based polymer composites for thermoconductive EMI shielding materials.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.51193