A Side-Pumping Package Design for Hybrid-Quantum-Dot Light Emitting Diodes

• Published in: IEEE photonics technology letters 2021-08, Vol.33 (16), p.804-807
• Main Authors: Huang, Chung-Ping, Lee, Ting-Yu, Yang, Jhen-Jia, Shih, Hsiang-Yun, Hsu, Shun-Chieh, Chen, Teng-Ming, Lin, Chien-Chung
• Format: Article
• Language: English
• Subjects: Heat distribution; Heating systems; Light emitting diodes; Light-emitting diodes (LEDs); material usage; Optical imaging; Optical pumping; Optical variables measurement; Perovskites; Photonics; Quantum dots; quantum dots (QDs); Temperature measurement; Thermal analysis; thermal dissipation
• ISSN: 1041-1135; 1941-0174
• DOI: 10.1109/LPT.2021.3065841

In this study, quantum dot light-emitting diodes with a side-pumping structure were designed for efficient heat management. The COMSOL Multiphysics software suite was used to conduct numerical evaluations. The electrical and optical field distributions and the heat distribution capability of the aforementioned structure were investigated. The side-pumping package was found to be capable of effectively dissipating heat and significantly reducing the areal temperature from 32.1 °C (in-chip) to 28.9 °C with an operating current of 35 mA. The integrated intensities of the perovskite quantum dot photons of the in-chip and side-pumping devices were approximately identical (1.23:1). However, the side-pumping device required 58.3% less filling material than the in-chip device. Optical and thermal modeling and measurements indicated that the side-pumping architecture can not only enhance thermal dissipation but also reduce the usage of quantum dot material. The findings of this study provide useful information for the incorporation of quantum dots in photonic devices.