A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging....

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Bibliographic Details
Published in:IEEE photonics journal 2021-08, Vol.13 (4), p.1-8
Main Authors: Huang, Chung-Ping, Lee, Ting-Yu, Yang, Jhen-Jia, Lin, Guan-Teng, Lin, Chien-Chung
Format: Article
Language:English
Subjects:
Embedded structures
heat
Heat transfer
Light emitting diodes
Optical pumping
Photonics
Quantum dot
Quantum dots
Radiant flux
Temperature measurement
Wires
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Summary:A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging. Under 1 W/cm 2 , the areal temperature decreased from 38.5 °C (without Sn-ball) to 32.3 °C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package. Specifically, the introduction of the metal ball structure engendered a two- to three-fold increase in lifetime. The study findings could contribute toward integrating quantum dots into photonic devices.
ISSN:1943-0655
1943-0655
1943-0647
DOI:10.1109/JPHOT.2021.3099313