Thermal resistance analysis of central processing unit cooling system based on cascade straight heat pipe

• Published in: IOP conference series. Materials Science and Engineering 2019-06, Vol.539 (1), p.12036
• Main Authors: Septiadi, W N, Ula, W A W, D Wulandari, I G A A, Tnunay, I A, Murti, M R
• Format: Article
• Language: English
• Subjects: Central processing units; Cooling; Cooling systems; CPUs; Heat; Heat flux; Heat pipes; Heat transfer; Thermal resistance
• ISSN: 1757-8981; 1757-899X
• DOI: 10.1088/1757-899X/539/1/012036

The development of electronic device is moving toward Smart Technologies, But, the idea of Smart Technologies brings a new problem to heat flux management because the device produces more heat to be banished, especially CPU. So to solve those problems, heat pipe was chosen to be an alternative solution. Heat pipe was hoped to be a passive cooling system technology, but further research shows that goal can't be achieved, due to the high condenser temperature, and the cooling system still needs fan support to banish the heat quickly from the device. So, this paper will discuss a research about new cascade system for heat pipe with variations of heat load and amount of condenser. The results were compared to non-cascade heat pipe to know its thermal performance, especially in thermal resistance. The results show that application of cascade straight heat pipe is effective to solve high condenser temperature problem. In thermal resistance, non-cascade heat pipe still better, but the differences only around 0.3-0.37 °C/W. For the comparison between single and double condenser, double condenser shows better thermal performance. In the end, this cascade heat pipe technology is effective to be applied for central processing unit cooling system technology.