Corrosion Assessment of Sn-0.7Cu Lead-Free Solder in 1 M Hydrochloric Acid

The corrosion performance of Sn-0.7Cu solder alloy is investigated in 1 M Hydrochloride acid by means of potentiodynamic polarization technique at the scan range of -2VSCE to 1 VSCE was applied to the sample at the scan rate of 1mV/s. Supporting morphological analysis was done by using Scanning Elec...

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Bibliographic Details
Published in:IOP conference series. Materials Science and Engineering 2019-12, Vol.701 (1), p.12058
Main Authors: Cong, Tan Xing, Mohamad, Ahmad Azmin, Nazeri, Muhammad Firdaus Mohd
Format: Article
Language:English
Subjects:
Corrosion
Corrosion products
Electron microscopes
Hydrochloric acid
Lead free
Morphology
Solders
Tin base alloys
Tin dioxide
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Summary:The corrosion performance of Sn-0.7Cu solder alloy is investigated in 1 M Hydrochloride acid by means of potentiodynamic polarization technique at the scan range of -2VSCE to 1 VSCE was applied to the sample at the scan rate of 1mV/s. Supporting morphological analysis was done by using Scanning Electron Microscope while phase analysis was confirmed by using X-ray Diffraction analysis. Morphological analysis showed two type of oxide layer has formed as corrosion product, which are compact oxide layer and loose rod-like oxide layer after corrosion analysis which confirmed to be SnO and SnO2. This indicate that complete protection from further corrosion was impossible due to the incomplete passivation layer formation.
ISSN:1757-8981
1757-899X
DOI:10.1088/1757-899X/701/1/012058