P‐6.12: Simulation and Analysis of Temperature Distribution and Reduction for LCM based on ANSYS

In this paper, based on ANSYS Workbench steady‐state thermal analysis, the results of temperature distribution of LCM (liquid crystal module) both under 22 °C and 75 °C are obtained. According to the simulation results: the maximum temperature with the LCM is about 40 °C, while the largest is 80 °C...

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Bibliographic Details
Published in:SID International Symposium Digest of technical papers 2021-08, Vol.52 (S2), p.879-882
Main Authors: Sun, Yaxin, Zhong, Peng, Sun, Lingyu, Zhao, Chaoyue, Liang, Fei, Hou, Tingxiu, Du, Jingjun
Format: Article
Language:English
Subjects:
Cooling effects
finite element simulation
Heat transmission
LCD module
Liquid crystals
temperature cooling down
Temperature distribution
Thermal analysis
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Summary:In this paper, based on ANSYS Workbench steady‐state thermal analysis, the results of temperature distribution of LCM (liquid crystal module) both under 22 °C and 75 °C are obtained. According to the simulation results: the maximum temperature with the LCM is about 40 °C, while the largest is 80 °C approximately if the ambient is 75 °C. In order to reduce the highest temperature for LCM, this paper decided to analysis the effect of heat conducting chip (HCC) and the cooling effect of ways for HCC attached to the back cover is also analyzed. For HCC is fully covered back cover, the largest temperature declined to around 77 °C and 38.9 °C respectively. And if the edge of HCC is 10‐mm width, the temperature also decreased by 2 °C, which is almost the same as HCC full attachment to back cover.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.15313