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Effect of creep on the mode II residual fracture energy of adhesives

Viscous flow that often occurs in adhesive materials leads to a permanent deformation when adhesives are subjected to creep loading. Creep loading has a significant influence on the strength of bonded structures. Due to the viscous behavior, the fracture energy also may change with time for joints t...

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Bibliographic Details
Published in:Journal of applied polymer science 2021-12, Vol.138 (47), p.n/a
Main Authors: Carneiro Neto, Ranulfo M., Akhavan‐Safar, Alireza, Sampaio, Eduardo M., Assis, Joaquim T., da Silva, Lucas F. M.
Format: Article
Language:English
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Summary:Viscous flow that often occurs in adhesive materials leads to a permanent deformation when adhesives are subjected to creep loading. Creep loading has a significant influence on the strength of bonded structures. Due to the viscous behavior, the fracture energy also may change with time for joints that experience creep loading in service. In this work the effects of two creep parameters (creep load and time) on the residual mode II fracture energy of an adhesive was investigated using end notched flexure (ENF) specimens. To achieve this, ENF samples were subjected to different creep loading levels at different creep times followed by quasi static tests to obtain the residual shear fracture energy of the adhesive. Experimental results showed that pre‐creep loading of the bonded structures can significantly improve the fracture energy and the static strength of the joints. In this work the effects of creep on the residual mode II fracture energy of an adhesive was experimentally analyzed using end notched flexure (ENF) specimens. To achieve this, first ENF samples were subjected to different creep loading levels and at different creep times. Then the joints were subjected to a quasi‐static loading conditions to obtain the residual shear fracture energy of the adhesive. Experimental results showed that pre‐creep loading can significantly improve the fracture energy of the adhesive.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.51387