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Polymer-based filament feedstock for additive manufacturing

Fused deposition modeling (FDM) or fused filament fabrication (FFF), which is based on polymer melting and extrusion, offers a unique manufacturing method to fabricate objects with complex geometries due to easy process for polymer deformation through melting and solidification and layer-by-layer ad...

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Bibliographic Details
Published in:Composites science and technology 2021-09, Vol.213, p.108876, Article 108876
Main Authors: Park, Soyeon, Fu, Kun (Kelvin)
Format: Article
Language:English
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Summary:Fused deposition modeling (FDM) or fused filament fabrication (FFF), which is based on polymer melting and extrusion, offers a unique manufacturing method to fabricate objects with complex geometries due to easy process for polymer deformation through melting and solidification and layer-by-layer additive manufacturing. Because of these advantages, FDM has attracted considerable attention over the past decades in a variety of fields including electronics, biomechanical engineering, and sustainable materials. As the demand for functional materials increases, polymer composites with diverse reinforcements such as carbon nanomaterials, metals, biomaterials, and ceramics have been tailored as feedstocks for FDM. Fabrication and printing with polymeric composite filaments require understandings of the physical and chemical properties as well as thermal-rheology behavior of polymer systems, which are crucial to advancing AM development. Herein, we first provide the working mechanism of FDM, the criteria for selecting polymers, and methods for manufacturing polymer and polymer composite filaments. After that, the physical and mechanical properties and printing conditions of the pure polymer filaments, multi-material/structure filaments, and various applications using polymer composite filaments are discussed and summarized. Finally, we share some of our perspectives for the future advance of polymer-based filament for FDM. [Display omitted]
ISSN:0266-3538
1879-1050
DOI:10.1016/j.compscitech.2021.108876