Modeling and experimental research on the evolution process of micro through-slit array generated with masked jet electrochemical machining

• Published in: Journal of materials processing technology 2021-12, Vol.298, p.117304, Article 117304
• Main Authors: Chen, Xiaolei, Zhu, Jiajun, Xu, Zhongzheng, Su, Guokang
• Format: Article
• Language: English
• Subjects: Arrays; Boundary conditions; ECM model; Electric fields; Electrochemical machining; Evolution; Evolution process; Grooves; Metal plates; Micro through-slit array; Slits; Tapering; Thin metallic plate; Workpieces
• ISSN: 0924-0136; 1873-4774
• DOI: 10.1016/j.jmatprotec.2021.117304

This paper proposed to prepare micro through-slit array on thin metallic plate with masked jet electrochemical machining. An ECM mathematic model was developed with ANSYS Parametric Design Language to analyze the evolution process of micro through-slit, including the broken through process of workpiece. In each step, machining status was monitored to judge whether the workpiece was broken through, then both model and boundary condition were reset accordingly, thus the broken through process was well solved. The simulation results indicated that with moving speed of workpiece decreasing (increasing machining time in ECM model), the sectional profile evolved from groove to a tapering micro through-slit, and a micro through-slit with low taper was formed at last. The changes of electric field distribution in both X and Z direction affected the material dissolution along the side wall of micro through-slit and contributed to the formation of micro through-slit. The experiments were performed with different moving speeds of workpiece, and the sectional profile evolution process agreed well with that in simulation. Moreover, with the same real machining time, low pulse duty cycle was useful to enhance the transport of electrolytic product in the small machining area and reduce the dimensional difference of micro through-slit. At last, ten micro through-slits with the length of 30 mm were well prepared at one time on a thin metallic plate of 50 μm. The width of upper surface and lower surface was 206.1 ± 2.28 μm and 193.7 ± 1.97 μm, respectively, and the taper was about 7.1°.