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Comparative performance of the ultra-short channel technology for the DG-FinFET characteristics using different high-k dielectric materials
The downscaling of the SOI-MOSFET device has an important role of the advanced technology in the semiconductor industry, so the researchers aim to find the structure which can improve the considerable reduction, this paper is investigated a proposal novel device in the nanoscale technology of the do...
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Published in: | Indian journal of physics 2021-10, Vol.95 (10), p.1977-1984 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The downscaling of the SOI-MOSFET device has an important role of the advanced technology in the semiconductor industry, so the researchers aim to find the structure which can improve the considerable reduction, this paper is investigated a proposal novel device in the nanoscale technology of the double-gate FinFET using different high-k materials gate (SiO
2
, SnO
2
, ZrO
2
and Ta
2
O
5
) for the ultra-short gate
L
g
= 5 nm on different parameters such as: the subthreshold voltage (SS), the threshold voltage (Vth), the transconductance (gm), the ON and OFF currents (
I
on
,
I
off
) and also the
I
on
/
I
off
ratio and the electrical field (
E
) by the three-dimensional TCAD-SILVACO simulator. The results reveal that the Ta
2
O
5
material of gate with high permittivity (
k
= 27) turns out better values for (Vth, SS, ON, OFF current and ON/OFF ratio current, gm, electrical field (
E
)) in comparison with other dielectric SiO
2
, SnO
2
, ZrO
2
which improve the performance of the device |
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ISSN: | 0973-1458 0974-9845 |
DOI: | 10.1007/s12648-020-01846-9 |