Near threshold fatigue crack growth in ultrafinegrained copper

• Published in: IOP conference series. Materials Science and Engineering 2014-08, Vol.63 (1), p.12158
• Main Authors: Arzaghi, M, Fintová, S, Sarrazin-Baudoux, C, Kunz, L, Petit, J
• Format: Article
• Language: English
• Subjects: Copper; Crack closure; Crack propagation; Electron microscopes; Environmental effects; Fatigue failure; Field emission microscopy; Fracture mechanics; High vacuum; Ion beams; Room temperature; Shielding; Stress intensity factors; Ultrafines
• ISSN: 1757-8981; 1757-899X
• DOI: 10.1088/1757-899X/63/1/012158

The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at ΔK ≤ 7 MPa√m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude AKeff appears to be the same driving force in both materials. Tests performed in high vacuum on UFG copper demonstrate the existence of a huge effect of environment with growth rates higher of about two orders of magnitude in air compared to high vacuum. This environmental effect on the crack path and the related microstructure is discussed on the basis of fractography observations performed using scanning electron microscope and completed with field emission scanning electron microscope combined with the focused ion beam technique.