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The synergistic effect of irregular alumina and round plates boron nitride binary‐particle system on the thermal conductivity of epoxy composites

As the main encapsulation material, epoxy resin has an urgent need to obtain higher thermal conductivity. So how to improve the thermal conductivity of epoxy resin is very important. In this work, a novel strategy is proposed that the irregular alumina (i‐Al2O3) and the round plate boron nitride (h‐...

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Published in:Journal of applied polymer science 2022-02, Vol.139 (8), p.n/a
Main Authors: Wu, Yincai, Lin, Fenglong, Lin, Xintu, Liu, Yuejun, Song, Lijun, Hao, Xihai, Li, Jinlei, Wang, Shenglong
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cited_by cdi_FETCH-LOGICAL-c2978-f7823d170850ded5aff890de27834c642854cea3ec8d46541e9d1efa704ea71d3
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container_title Journal of applied polymer science
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description As the main encapsulation material, epoxy resin has an urgent need to obtain higher thermal conductivity. So how to improve the thermal conductivity of epoxy resin is very important. In this work, a novel strategy is proposed that the irregular alumina (i‐Al2O3) and the round plate boron nitride (h‐BN) are integrated into epoxy resin to enhance the thermal conductivity. When the total amount of filler is 40%, and the volume ratio of auxiliary filler h‐BN and the basic filler i‐Al2O3 is 6: 34,The thermal conductivity of the epoxy composites is significantly increased 709% higher than that of pure epoxy resin. The roles of the main filler i‐Al2O3 and the auxiliary filler h‐BN in epoxy composites system were investigated. A possible mechanism was established that the h‐BN connects i‐Al2O3 to generate the heat conduction network. The blending of irregular particles and round plate method proposed in this work is a new avenue, which meets the need of industrialized design and fabricating, making an achievement of obtaining a kind of epoxy composites with a high thermal conductivity and excellent comprehensive properties. The irregular alumina (i‐Al2O3) and the round plate boron nitride (h‐BN) were integrated into epoxy resin to enhance the thermal conductivity, and a possible mechanism was established. The effect of i‐Al2O3 and h‐BN on the thermal conductivity, volume resistance, viscosity coefficient, mechanical properties and thermal properties of epoxy composite have been studied.
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So how to improve the thermal conductivity of epoxy resin is very important. In this work, a novel strategy is proposed that the irregular alumina (i‐Al2O3) and the round plate boron nitride (h‐BN) are integrated into epoxy resin to enhance the thermal conductivity. When the total amount of filler is 40%, and the volume ratio of auxiliary filler h‐BN and the basic filler i‐Al2O3 is 6: 34,The thermal conductivity of the epoxy composites is significantly increased 709% higher than that of pure epoxy resin. The roles of the main filler i‐Al2O3 and the auxiliary filler h‐BN in epoxy composites system were investigated. A possible mechanism was established that the h‐BN connects i‐Al2O3 to generate the heat conduction network. 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subjects Aluminum oxide
Boron nitride
Composite materials
Conduction heating
Conductive heat transfer
epoxy composites
Epoxy resins
Fillers
Heat conductivity
irregular alumina
Irregular particles
Materials science
Polymers
Rapid prototyping
round plate boron nitride
Synergistic effect
Thermal conductivity
title The synergistic effect of irregular alumina and round plates boron nitride binary‐particle system on the thermal conductivity of epoxy composites
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