Enhanced mechanical properties and thermal conductivity of W-30Cu composite fabricated with monodisperse and nearly spherical W powder

• Published in: International journal of refractory metals & hard materials 2021-12, Vol.101, p.105663, Article 105663
• Main Authors: Chen, Zheng, Li, Bingxue, Zhang, Qiao, Ding, Yi, Zhu, Zhixiang, Xiao, Peng, Liang, Shuhua
• Format: Article
• Language: English
• Subjects: Compressive strength; Ductility; Ductility tests; Grain size; Heat conductivity; Heat transfer; Homogeneity; Mechanical properties; Microstructure; Room temperature; Spherical powders; Thermal conductivity; W powder; W-Cu composite
• ISSN: 0263-4368; 2213-3917
• DOI: 10.1016/j.ijrmhm.2021.105663

In this study, the W-30Cu composite was fabricated by infiltration using monodisperse and nearly spherical W powder, which was prepared via jet milling. Compared with the conventional W-30Cu composite, the microstructure homogeneity of the as-prepared W-30Cu composite has been dramatically improved, and the W-W contiguity and variable coefficient of W grain size are as low as 0.324 and 0.28, respectively. Hence, in both tensile and compressive test, the as-prepared W-30Cu composite exhibits higher strength and ductility. The uniform microstructure also enhances the thermal conductivity of the W-Cu composites at all temperatures. At room temperature, the thermal conductivity of the as-prepared W-30Cu composite is 256.7 W·m−1·K−1, reaching 96.9% of the theoretical value. •The microstructure homogeneity of the W-Cu composite has been dramatically improved.•The W-W contiguity and variable coefficient of W grain size are as low as 0.324 and 0.28.•The as-prepared W-30Cu composite exhibits higher strength and ductility.•The uniform microstructure enhances the thermal conductivity at all temperatures.