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Refined WC grain size and improved mechanical properties in a hardmetal WC-8Co processed via short-time semi-solid hot pressing
•A new approach namely short-time semi-solid hot-pressing (STSSHP) is developed.•STSSHP produces fully dense WC-Co hardmetals with minimized WC grain growth.•WC-Co hardmetals processed via STSSHP exhibit higher hardness and ductility. To minimize WC grain growth and avoid WC-WC non-metallurgical con...
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Published in: | Journal of alloys and compounds 2021-12, Vol.889, p.161560, Article 161560 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | •A new approach namely short-time semi-solid hot-pressing (STSSHP) is developed.•STSSHP produces fully dense WC-Co hardmetals with minimized WC grain growth.•WC-Co hardmetals processed via STSSHP exhibit higher hardness and ductility.
To minimize WC grain growth and avoid WC-WC non-metallurgical contacts in WC-Co hardmetals, we modified conventional solid-state hot pressing into short-time semi-solid hot pressing (STSSHP) for consolidation of WC-Co powders in the present study. STSSHP can produce fully dense WC-Co hardmetals free of WC-WC non-metallurgical contacts at semi-solid temperatures lower than the ideal liquid-phase sintering temperatures within several to several ten seconds, thus minimizing WC grain growth. Herein WC-8 wt%Co processed by STSSHP at 1340 ℃ (the WC-Co eutectic temperature) for only ~15 s achieved a relative density of 99.92% without WC-WC non-metallurgical contacts. Only slight WC grain growth occurred during STSSHP relative to grain sizes in powders. The STSSHP-ed WC-8 wt%Co exhibited much smaller WC grains and thus higher hardness, fracture toughness and bend strength than those in its liquid-phase sintered counterparts. STSSHP provides a novel avenue to retain fine WC grains and hence to improve both hardness and ductility of WC-Co hardmetals. |
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ISSN: | 0925-8388 1873-4669 |
DOI: | 10.1016/j.jallcom.2021.161560 |