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Eight-Level/Cell Storage by Tuning the Spatial Distribution of Dielectrics in a Tri-Layer ReRAM Cell: Electrical Characteristics and Reliability
Eight level resistance switching in a tri-layer ReRAM cell (ZrO x /AlO x /HfO x ) of fixed stack thickness was obtained by tuning the spatial location of its intermediate AlO x layer hence by varying its spatial distribution of three dielectrics. Here we have investigated the underlying reason behin...
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Published in: | IEEE transactions on device and materials reliability 2021-12, Vol.21 (4), p.587-593 |
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Main Authors: | , , |
Format: | Magazinearticle |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Eight level resistance switching in a tri-layer ReRAM cell (ZrO x /AlO x /HfO x ) of fixed stack thickness was obtained by tuning the spatial location of its intermediate AlO x layer hence by varying its spatial distribution of three dielectrics. Here we have investigated the underlying reason behind the observed well separated low power resistance switching in this type of valance change memory (VCM) cell achieved by varying its SET current compliance and discussed stack design aspect which impacts its characteristics. Electrical characteristics of a favorable cell obtained by our scheme demonstrate non-overlapped and retainable resistance levels even followed by dc endurance cycles. 10 6 SET/RESET cycle-based ac-endurance measurement was furthermore performed to assess resistance margin between the HRS and the LRS, and favorable cell exhibited well behaved cell-to-cell and cycle-to-cycle variabilities of its resistance states. Furthermore, retention measurements conducted at room temperature and at 85°C demonstrate stable non-overlapped resistance levels as suitable for the multi-level/cell storage. SET bias scaling of the favorable cell has been finally assessed by numerical simulation |
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ISSN: | 1530-4388 1558-2574 |
DOI: | 10.1109/TDMR.2021.3120966 |